Interfacial shear stress, peeling stress, and die cracking stress in trilayer electronic assemblies

IEEE Transactions on Components and Packaging Technologies

Volumn 23, Issue 2, 2000, Pages 309-316

  Wang, Kang Ping ^a   Huang, Yonggang Young ^b   Chandra, Abhijit ^c   Hu, Kai Xiong ^c  

^a GENERAL MOTORS CORPORATION   (United States)

^b University of Illinois at Urbana Champaign   (United States)

^c Iowa State University of Science and Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ELASTIC MODULI; FAILURE (MECHANICAL); FINITE ELEMENT METHOD; MULTILAYERS; SHEAR STRESS; THERMAL STRESS;

DIE CRACKING STRESS; INTERFACIAL SHEAR STRESS; PEELING STRESS; TRILAYER ELECTRONIC ASSEMBLIES;

ELECTRONICS PACKAGING;

EID: 0033690242     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.846769     Document Type: Article

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