Determination of the interfacial fracture toughness of laminated silicon die on adhesive dicing tape from stud pull measurement

2006 International Conference on Electronic Materials and Packaging, EMAP

Volumn , Issue , 2006, Pages

  Cheung, Y M ^a   Chong, Arthur C M ^a   Huang, B ^a  

^a 4/F Watson Centre   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; INTEGRAL EQUATIONS; LAMINATING; MATERIALS SCIENCE; PACKAGING MATERIALS; SILICON; STUDS (FASTENERS); STUDS (STRUCTURAL MEMBERS); TAPES;

DICING TAPES; NORMAL FORCES;

FRACTURE TOUGHNESS;

EID: 51449105428     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2006.4430638     Document Type: Conference Paper

References (13)

1. th IEEE CPMT International Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HD'05), Shanghai, China, 27-30 June 2005, pp.36-41.
2. th Electronic Components and Technology Conf, San Diego, California, May 30 -June 2, 2006, pp. 1317-1322
3. th Electronic Components and Technology Conf, San Diego, California, May 30 -June 2, 2006, pp. 1312-1316.
4. Ozawa, T., et al, "Adheisve Properties of Ultraviolet Curable Pressure-Sensitive Adhesive Tape for Semiconductor Processing (I) - Interpretation via Rheological Viewpoint," Furukawa Review, No. 20 (2001), pp. 83-88.
5. For example, ASM model AD8912SD 12" automatic die bonder with thin die handling kit. Refer to www.asmpacific.com.
6. Ablestik RP-787-3DS is also known as Ablestik ATB-225-12 for slightly changes in thickness.
7. Section 10.2.1 Submodeling in ABAQUS Analysis User's Manual version 6.6.
8. Yao, Q.. et al, "Characterization of Underfill/Substrate Interfacial Toughness Enhancement by Silane Additivies," IEEE Trans. on Electronic Packaging Manufacturing, Vol. 22, No. 4 (1999), pp. 264-267.
9. Kuhl, A. and Qu, J., "A Technique to Measure Interfacial Toughness over a Range of Phase Angles," Trans. of the ASME Journal of Electronic Packaging, Vol. 122 (2000), pp. 147-151.
10. Rice, J.R., "A Path Independent Integral and the Approximate Analysis of Stain Concentration by Notches and Cracks", ASME Trans. Series E - Jounal of Applied Mechanics, Vol. 35 (1968), pp. 379-386.
11. Rice, J.R., "Elastic Fracture Concepts for Interfacial Cracks", ASME Trans. Series E - Jounal of Applied Mechanics, Vol. 55 (1988), pp. 98-103.
12. Hutchinson, J.W., "Mixed Mode Cracking in Layered Materials," Advances in applied Mechnics, Vol. 29 (1992), 63-187.
13. Wang, J. and Qiao, P., "Fracture Analysis of Shear Deformable Bi-Material Interface," ASCE Journal of Engineering Mechanics, Vol. 132:3 (2006), pp. 306-316.