Delamination Risk Evaluation for Plastic Packages Based on Mixed Mode Fracture Mechanics Approaches

Journal of Electronic Packaging

Volumn 124, Issue 4, 2002, Pages 318-322

  Auersperg, J ^a,b   Kieselstein, E ^c   Schubert, A ^b   Michel, B ^b  

^a AMIC Angewandte Micro Messtechnik GmbH   (Germany)

^b FRAUNHOFER IZM   (Germany)

^c CWM Chemnitzer Wekstoffmechanik GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0038288396     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1501303     Document Type: Article

References (23)

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