Application of a genetic algorithm associated with adhesive joint analysis to the IC chip pick-up process

Journal of Adhesion Science and Technology

Volumn 22, Issue 10-11, 2008, Pages 1057-1072

  Cheng, Tung Hua ^a   Tseng, Ching Huan ^b   Hung, Ching Hua ^b  

^a NATIONAL FORMOSA UNIVERSITY   (Taiwan)

^b NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

Adhesive; Concentrated force; Genetic algorithm; IC pick up process; Joint

Indexed keywords

ADHESIVE JOINTS; ALGORITHMS; ARSENIC COMPOUNDS; BOOLEAN FUNCTIONS; BOUNDARY VALUE PROBLEMS; ELASTIC MODULI; GENETIC ALGORITHMS; MECHANICAL PROPERTIES; RISK ASSESSMENT; THEOREM PROVING;

ADHESIVE LAYERS; ADHESIVE THICKNESS; BONDED JOINTS; CONCENTRATED FORCES; IC CHIPS; JOINT ANALYSIS; MATE RIAL PROPERTIES; PICK-UP;

BOUNDARY CONDITIONS;

EID: 47749149551     PISSN: 01694243     EISSN: 15685616     Source Type: Journal    
DOI: 10.1163/156856108X305921     Document Type: Article

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