Thermal stresses in layered electronic assemblies

Journal of Electronic Packaging, Transactions of the ASME

Volumn 119, Issue 2, 1997, Pages 127-132

  Jiang, Z Q ^a   Huang, Y ^a   Chandra, A ^a  

^a Michigan Technological University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; FAILURE (MECHANICAL); FINITE ELEMENT METHOD; INTERFACES (MATERIALS); PEELING; SHEAR STRESS; STRESS ANALYSIS; STRESS CONCENTRATION; THERMAL STRESS;

BEAM THEORY; PEELING STRESS;

ELECTRONICS PACKAGING;

EID: 0031166703     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792218     Document Type: Article

References (18)

1. Bogy, D. B., 1968, “Edge-Bonded Dissimilar Orthogonal Elastic Wedges Under Normal and Shear Loading,” ASME Journal of Applied Mechanics, Vol. 35, pp. 460-466.
2. Bogy, D. B., 1970, “On the Problem of Edged-Bonded Elastic Quarter Planes Loaded at the Boundary,” International Journal of Solids and Structures, Vol. 35, pp. 1287-1313
3. Chen, D., Cheng, S., and Gerhart, T. D., 1982, “Thermal Stresses in Laminated Beams,” Journal of Thermal Stresses, Vol. 23, pp. 67-84.
4. Chen, W. T., and Nelson, C. W., 1979, “Thermal Stresses in Bolted Joints,” IBM Journal of Research and Development, Vol. 23, pp. 178-188.
5. Delale, F., Erodgan, F., and Aydinoglu, M. N., 1981, “Stresses in Adhesively Bonded Joints: A Close-Form Solution,” Journal of Composite Materials, Vol. 15, pp. 249-271.
6. Hein, V. L., and Erdogan, F., 1971, “Stress Singularities in a Two-Material Wedge,” International Journal of Fracture Mechanics, Vol. 7, pp. 317-330.
7. Kuo, A. Y., 1989, “Thermal Stresses at the Edge of a Bimetallic Thermostat,” ASME Journal of Applied Mechanics, Vol. 56, pp. 585-589.
8. Lau, J. H., 1989, “A Note on the Calculation of Thermal Stresses in Electronic Packaging by Finite Element Methods,” ASME Journal of Electronic Packaging, Vol. Ill, pp. 313-320.
9. Lee, M., and Jasiuk, I., 1991, “Asymptotic Expansions for the Thermal Stresses in Bonded Semi-Infinite Bimaterial Strips,” ASME Journal of Electronic Packaging, Vol. 113, pp. 173-177.
10. Mirman, H. B., 1991, “Effects of Peeling Stresses in Bimaterial Assembly,” ASME Journal of Electronic Packaging, Vol. 113, pp. 431-433.
11. Pao, Y.-H., and Eisele, E., 1991, “Interfacial Shear and Peel Stresses in Multilayered Thin Stacks Subjected to Uniform Thermal Loading,” ASME Journal of Electronic Packaging, Vol. 113, pp. 164-172.
12. Suhir, E., 1986, “Stresses in Bi-Metal Thermostats,” ASME Journal of Applied Mechanics, Vol. 53, pp. 657-660.
13. Suhir, E., 1988, “An Approximate Analysis of Stresses in Multilayered Elastic Thin Films,” ASME Journal of Applied Mechanics, Vol. 55, pp. 143-148.
14. Suhir, E., 1989, “Interfacial Stresses in Bimaterial Thermostats,” ASME Journal of Applied Mechanics, Vol. 56, pp. 596-600.
15. Suhir, E., 1994, “Approximate Evaluation of the Elastic Thermal Stresses in a Thin Film Fabricated on a Very Thick Circular Substrate,” ASME Journal of Electronic Packaging, Vol. 116, pp. 171-176.
16. Timoshenko, S. P., 1925, “Analysis of Bi-Metal Thermostats,” Journal of the Optical Society of America, Vol. 11, pp. 233-255.
17. Timoshenko, S. P., and Goodier, J. N., 1951, Theory of Elasticity, McGraw-Hill, New York.
18. Yin, W.-L., 1991, “Thermal Stresses and Free-Edge Effects in Laminated Beams: A Variational Approach Using Stress Functions,” ASME Journal of Electronic Packaging, Vol. 113, pp. 68-75