Analysis of high speed shear characteristics of Sn-Ag-Cu solder joints

Electronic Materials Letters

Volumn 7, Issue 4, 2011, Pages 365-373

  Kumar, Santosh ^a   Park, Jae Yong ^b   Jung, Jae Pil ^a  

^a University of Seoul   (South Korea)

^b PDF Solutions   (United States)

Author keywords

electronic materials; high speed shear test; mechanical properties; scanning electron microscopy (SEM); soldering

Indexed keywords

BRITTLE FAILURES; DUCTILE FAILURES; ELECTRONIC MATERIALS; FAILURE MECHANISM; FAILURE MODE ANALYSIS; FORCE-DISPLACEMENT CURVES; HEIGHT VARIATION; HIGH SPEED SHEAR TEST; HIGH SPEED SHEARS; MAXIMUM SHEARS; SCANNING ELECTRONS; SHEARING RATES; SN-AG-CU; SNAGCU SOLDER; SOLDER JOINTS; SOLDER VOLUME;

FAILURE MODES; MECHANICAL PROPERTIES; SCANNING ELECTRON MICROSCOPY; SHEARING; SHEARING MACHINES; SILVER; SILVER ALLOYS; SOLDERING; SOLDERING ALLOYS; TIN ALLOYS;

TIN;

EID: 84862908771     PISSN: 17388090     EISSN: 20936788     Source Type: Journal    
DOI: 10.1007/s13391-011-0160-5     Document Type: Article

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