Microstructure evolution in Cu pillar/eutectic snpb solder system during isothermal annealing

Metals and Materials International

Volumn 15, Issue 5, 2009, Pages 815-818

  Kim, Byoung Joon ^a   Lim, Gi Tae ^b   Kim, Jaedong ^c   Lee, Kiwook ^c   Park, Young Bae ^b   Lee, Ho Young ^a   Joo, Young Chang ^a  

^a Seoul National University   (South Korea)

^b Andong National University   (South Korea)

^c Amkor Technology Korea Inc   (South Korea)

Author keywords

Activation energy; Cu pillar; Intermetallic compound; Kirkendall void

Indexed keywords

ACTIVATION ENERGY; BINARY ALLOYS; COPPER COMPOUNDS; INTERMETALLICS; ISOTHERMAL ANNEALING; ISOTHERMS; LEAD ALLOYS; TIN; TIN ALLOYS;

ATOMIC DIFFUSIONS; CU PILLAR; DIFFUSION-LIMITED PROCESS; KIRKENDALL VOID; MICRO-STRUCTURE EVOLUTIONS; PARABOLIC RATE LAW; SNPB SOLDER;

GROWTH RATE;

EID: 70450250268     PISSN: 15989623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s12540-009-0815-4     Document Type: Article

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