Failure mechanism of Pb-bearing and Pb-free solder joints under high-speed shear loading

Metals and Materials International

Volumn 16, Issue 1, 2010, Pages 7-12

  Kim, Jong Woong ^a   Jung, Seung Boo ^b  

^a Korea Electronic Technology Institute (KETI)   (South Korea)

^b Sungkyunkwan University   (South Korea)

Author keywords

Alloys; Computer simulation; High speed shear test; Mechanical properties; Soldering

Indexed keywords

ALLOYING; BALL GRID ARRAYS; BINARY ALLOYS; COMPUTER SIMULATION; FAILURE (MECHANICAL); MECHANICAL PROPERTIES; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING; SPEED; STRAIN HARDENING; STRAIN RATE; TIN ALLOYS; UNIVERSAL JOINTS;

BRITTLE INTERFACIAL FRACTURE; FAILURE BEHAVIORS; FAILURE MECHANISM; HARDENING EFFECTS; HIGH SPEED SHEARS; HIGH STRAIN RATES; INTERFACIAL REGION; PB-FREE SOLDER JOINTS;

LEAD-FREE SOLDERS;

EID: 78149462964     PISSN: 15989623     EISSN: 20054149     Source Type: Journal    
DOI: 10.1007/s12540-010-0007-x     Document Type: Article

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