The specific work of fracture in ball shear test and the integrity of solder balls

Materials Science and Engineering: A

Volumn 428, Issue 1-2, 2006, Pages 67-72

  Chia, Julian Yan Hon ^a   Cotterell, Brian ^a,b   Cheong, Augustine Yew Heng ^a  

^a INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING   (Singapore)

^b UNIVERSITY OF SYDNEY   (Australia)

Author keywords

Ball shear test; Essential work of fracture; Fracture toughness; Solder

Indexed keywords

APPROXIMATION THEORY; FRACTURE TOUGHNESS; FRICTION; PLASTIC DEFORMATION; SHEAR STRESS; SHEARING;

BALL SHEAR TEST; ESSENTIAL WORK OF FRACTURE; SOLDER BALLS;

SOLDERING ALLOYS;

APPROXIMATION THEORY; FRACTURE TOUGHNESS; FRICTION; PLASTIC DEFORMATION; SHEAR STRESS; SHEARING; SOLDERING ALLOYS;

EID: 33745509371     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2006.04.052     Document Type: Article

References (5)

1. Chia J.Y.H., Cotterell B., and Cheong T.C. Mater. Sci. Eng. A 417 (2006) 259-274
2. JESD22-B117, BGA ball shear, JEDEC Solid State Technology Association, 2000.
3. Erich R., Coyle R.J., Wenger G.M., and Primavera A. IEEE/CPMT International Electronics Manufacturing Technology Symposium (1999) 16-22
4. Newman K. Electronic Components and Technology Conference (ECTC) (2005) 1194-1201
5. Cotterell B., and Reddel J.K. Int. J. Fracture 13 (1977) 267-277