Insights into correlation between board-level drop reliability and package-level ball impact test

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 455-461

  Yeh, Chang Lin ^a   Lai, Yi Shao ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; FRACTURE MECHANICS; INTERMETALLICS; SILVER; SOLDERED JOINTS; TIN;

BALL IMPACT TESTS; DROP RELIABILITY; IMPACT FORCES;

ELECTRONICS PACKAGING;

EID: 33845564380     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645686     Document Type: Conference Paper

References (26)

1. th Electr. Comp. Technol. Conf., Lake Buena Vista, FL, 2005, pp. 1202-1209.
2. th Int. Symp. Microelectr., Long Beach, CA, 2004.
3. th Int. Conf. Electr. Mater. Pack., Penang, Malaysia, 2004, pp. 56-60.
4. th Electr. Comp. Technol. Conf., Lake Buena Vista, FL, 2005, pp. 1519-1525.
5. th Int. Symp. Microelectr., Philadelphia, PA, 2005, pp. 199-205.
6. th Electr. Pack. Technol. Conf., Singapore, 2005, pp. 255-261.
7. Lai, Y.-S. et al, "Experimental Studies of Board-level Reliability of Chip-scale Packages Subjected to JEDEC Drop Test Condition," Microelectr. Reliab. Vol. 46, No. 2-4 (2006), pp. 645-650.
8. Chong, D. Y. R. et al, "Drop Impact Reliability Testing for Lead-free and Lead-based Soldered IC Packages," Microelectr. Reliab., in press.
9. st Electr. Comp. Technol. Conf., Orlando, FL, 2001, pp. 1065-1071.
10. Canumalla, S. et al, "Package to Board Inter-connection Shear Strength (PBISS): Effect of Surface Finish, PWB Build-up Layer and Chip Scale Package Structure," IEEE Trans. Comp. Pack. Technol. Vol. 27, No. 1 (2004), pp. 182-190.
11. Date, M. et al, "Ductile-to-brittle Transition in Sn-Zn Solder Joints Measured by Impact Test," Scripta Mater. Vol. 51 (2004), pp. 641-645.
12. th Electr. Comp. Technol. Conf., Lake Buena Vista, FL, 2005, pp. 467-471.
13. th Electr. Comp. Technol. Conf., Lake Buena Vista, FL, 2005, pp. 1194-1201.
14. th Electr. Pack. Technol. Conf., Singapore, 2005, pp. 270-275.
15. Yeh, C.-L. and Lai, Y.-S., "Development of Ball Impact Test System," Proc. ITherm 2006, San Diego, CA, 2006.
16. JEDEC Solid State Technology Association, JESD22-B111: Board Level Drop Test Method of Component for Handheld Electronics Products, 2003.
17. Yeh, C.-L. and Lai, Y.-S., "Support Excitation Scheme for Transient Analysis of JEDEC Board-level Drop Test," Microelectr. Reliab. Vol. 46, No. 2-4 (2006), pp.626-636.
18. Yeh, C.-L. et al, "Evaluation of Board-level Reliability of Electronic Packages Under Consecutive Drops," Microelectr. Reliab., in press.
19. Yeh, C.-L. et al, "Transient Deformation and Fracturing of Solder Joints Subjected to Impact Loads," Proc IMAPS Flip Chip 2004, Austin, TX, 2004.
20. Yeh, C.-L. and Lai, Y.-S., "Transient Analysis of Fracturing Modes of Solder Joints Subjected to Impact Loads," Proc. 2004 Taiwan ANSYS Conf., Nantou, Taiwan, 2004, pp. 25-30.
21. th Electr. Pack. Technol. Conf., Singapore, 2004, pp. 689-694.
22. Yeh, C.-L. and Lai, Y.-S., "Transient Analysis of Impact Fracturing of Solder Joints," Proc. EuroSimE 2005, Berlin, Germany, 2005, pp. 503-509.
23. Yeh, C.-L. et al, "Numerical Investigations of Displacement- controlled Impact Loads on Solder Joints," Proc. IMAPS Taiwan 2005 Int. Tech. Symp., Taipei, Taiwan, 2005, pp. 44-49.
24. Yeh, C.-L. and Lai, Y.-S., "Transient Fracturing of Solder Joints Subjected to Displacement-controlled Impact Loads," Microelectr. Reliab., in press.
25. Yeh, C.-L. and Lai, Y.-S., "Effects of Solder Alloy Constitutive Relationships on Impact Force Responses of Package-level Solder Joints Under Ball Impact Test," J. Electr. Mater., in press.
26. th Int. Symp. Microelectr., Philadelphia, PA, 2005, pp. 586-593.