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Journal of Korean Institute of Metals and Materials

Volumn 49, Issue 3, 2011, Pages 237-242

Effect of shearing speed on high speed shear properties of Sn1.0Ag0.5Cu solder bump on various UBM's

(2) Lee, Wang Gu a Jung, Jae Pil a

a University of Seoul (South Korea)

Author keywords

Electrical electronic materials; Mechanical properties; Scanning electron microscopy(sem); Shear test; Soldering

Indexed keywords

ELECTRICAL/ELECTRONIC MATERIALS; ELECTROLESS; ELECTROLESS NICKEL; FRACTURE MODE; FRACTURE SURFACES; HIGH SHEAR; HIGH SPEED SHEARS; ORGANIC SOLDERABILITY PRESERVATIVE; REFLOW--SOLDERING; SCANNING ELECTRONS; SHEAR ENERGY; SHEAR FORCE; SHEAR TEST; SHEAR TESTS; SOLDER BALLS; SOLDER BUMP; SPEED-UPS; UNDER-BUMP METALLURGIES;

ELECTRIC PROPERTIES; FLIP CHIP DEVICES; FRACTURE; MATERIALS PROPERTIES; MECHANICAL PROPERTIES; NICKEL METALLURGY; PRINTED CIRCUIT BOARDS; SCANNING ELECTRON MICROSCOPY; SHEAR FLOW; SHEARING; SOLDERING; SOLDERING ALLOYS; SPEED; TIN;

SHEARING MACHINES;

EID: 79955378387 PISSN: 17388228 EISSN: None Source Type: Journal
DOI: 10.3365/KJMM.2011.49.3.237 Document Type: Article

Times cited : (5)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.