Electroless Ni plating to compensate for bump height variation in Cu-Cu 3-D packaging

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 2, Issue 6, 2012, Pages 964-970

  Lee, Jaesik ^a   Fernandez, Daniel Moses ^a   Paing, Myo ^a   Yeo, Yen Chen ^a   Gao, Shan ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

3 D packaging; Cu Cu; electroless; Ni plating; thermocompression

Indexed keywords

3D PACKAGING; CU-CU; ELECTROLESS; NI PLATING; THERMO-COMPRESSION;

CHIP SCALE PACKAGES; FLIP CHIP DEVICES; STUDS (STRUCTURAL MEMBERS); THREE DIMENSIONAL;

PLATING;

EID: 84861935593     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2011.2177269     Document Type: Article

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