Plasma cleaning on bond pad surfaces for gold wire bonding

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2009, Pages 473-478

  Li, Wu Hu ^a   Reingruber, Klaus ^a   Mais, Norbert ^b   Acuesta, Albert ^a   Yape, Christian Alde ^a  

^a INFINEON TECHNOLOGIES ASIA PACIFIC PTE LTD   (Singapore)

^b INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

AL OXIDE; AR PLASMAS; BALL SHEAR; BOND PAD; BONDABILITY; FIELD EMISSION SCANNING ELECTRON MICROSCOPY; GOLD WIRE; INITIAL STAGES; INTER-DIFFUSION; PLASMA CLEANING; PROCESSABILITY; SHEAR MODES; SHEAR VALUES; SURFACE CONDITIONS; WIREBONDING;

ALUMINUM; AUGER ELECTRON SPECTROSCOPY; ELECTRONICS PACKAGING; FIELD EMISSION; FIELD EMISSION MICROSCOPES; GOLD; GOLD COATINGS; PALLADIUM; PLASMAS; SCANNING ELECTRON MICROSCOPY; SURFACE CLEANING; WIRE;

SURFACE MORPHOLOGY;

EID: 77950943847     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2009.5416501     Document Type: Conference Paper

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