Multiple-chip precise self-aligned assembly for hybrid integrated optical modules using Au-Sn solder bumps

IEEE Transactions on Advanced Packaging

Volumn 24, Issue 4, 2001, Pages 569-575

  Sasaki, Jun'ichi ^b   Ito, Masataka ^a,c   Tamanuki, Takemasa ^b   Hatakeyama, Hiroshi ^b   Kitamura, Shotaro ^b   Shimoda, Tsuyoshi ^b   Kato, Tomoaki ^a,b  

^a IEEE

^b NEC CORPORATION   (Japan)

^c Optobahn Corp   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

HYBRID INTEGRATED OPTOELECTRONIC MODULE PACKAGING; MULTICHANNEL OPTOELECTRONIC MODULES; OPTICAL CHIPS; OPTICAL TRANSMITTERS; SOLDER BUMPS;

GOLD; HYBRID INTEGRATED CIRCUITS; INTEGRATED OPTOELECTRONICS; MULTICHIP MODULES; OPTICAL FIBERS; OPTICAL WAVEGUIDES; SELF ASSEMBLY; SOLDERING; TELECOMMUNICATION NETWORKS; TELECOMMUNICATION TRAFFIC; TIN;

ELECTRONICS PACKAGING;

EID: 0035521101     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.982846     Document Type: Article

References (12)

1. High performance semiconductor optical amplifier gate for fast WDM packet switching
2. Hybrid-integrated 4 × 4 optical gate matrix switch using silica-based optical waveguides and LD array chips
3. Hybrid integration of spot-size converted semiconductor optical amplifier on planar lightwave circuit platform using passive alignment technique
4. Self-aligned flip-chip assembly of photonic devices with electrical and optical connections
5. A micro interconnection technique using solder bumps for high-speed optical devices
6. Use of solder bumps in three-dimensional passive aligned packaging of LD/PD arrays on Si optical benches
7. Self-aligned assembly technology for laser modules using stripe-type AuSn solder bump flip-chip bonding
8. 10 Gb/s photonic cell switching with hybrid 4 × 4 optical matrix switching module on silica based planar waveguide platform
9. Hybrid integrated 4 × 4 optical matrix switch using self-aligned semiconductor optical amplifier gate arrays and silica planar lightwave circuit
10. Hybrid integrated 4 × 4 matrix optical switch using silica based planar lightwave circuit
11. Spot size converter integrated semiconductor optical amplifier gates with low power consumption
12. Silica based optical waveguide devices, with novel fiber guide structure for alignment-free fiber coupling