Growth kinetics of intermetallic compounds and tensile properties of Sn-Ag-Cu/Ag single crystal joint

Journal of Alloys and Compounds

Volumn 461, Issue 1-2, 2008, Pages 410-417

  Zou, Hefei ^a   Zhu, Qingsheng ^a   Zhang, Zhefeng ^a  

^a INSTITUTE OF METAL RESEARCH   (China)

Author keywords

Ag single crystal substrate; Fracture; Growth kinetics; Intermetallic compounds (IMCs); Sn 3.8Ag 0.7Cu solder; Tensile strength

Indexed keywords

AGING OF MATERIALS; DIFFUSION; FRACTURE MECHANICS; GROWTH KINETICS; INTERMETALLICS; SOLDERED JOINTS; TENSILE STRENGTH;

AGING TIME; SINGLE CRYSTAL JOINTS; SINGLE CRYSTAL SUBSTRATES; SOLID STATE AGING;

SINGLE CRYSTALS;

EID: 44649193003     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2007.07.001     Document Type: Article

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