Phase-Field Modeling for Sn-Bi Soldering

Journal of Electronic Materials

Volumn 32, Issue 12, 2003, Pages 1534-1539

  Ode, Machiko ^a,b   Koyama, Toshiyuki ^b   Onodera, Hidehiro ^b   Suzuki, Toshio ^a  

^a UNIVERSITY OF TOKYO   (Japan)

^b NATIONAL INSTITUTE FOR MATERIALS SCIENCE   (Japan)

Author keywords

Liftoff; Pb free solder; Phase field model; Segregation; Sn Bi

Indexed keywords

BISMUTH; COPPER; INTERFACES (MATERIALS); SEGREGATION (METALLOGRAPHY); SOLIDIFICATION; SUBSTRATES; THIN FILMS; TIN; TIN ALLOYS;

LIFTOFF; PB-FREE SOLDER; PHASE-FIELD MODEL; SN-BI;

SOLDERING;

EID: 0942266964     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0126-y     Document Type: Conference Paper

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