Cubic boron nitride film residual compressive stress relaxation by post annealing

Diamond and Related Materials

Volumn 20, Issue 8, 2011, Pages 1179-1182

  Yang, Hangsheng ^a   Chen, Aili ^a   Qiu, Famin ^a  

^a ZHEJIANG UNIVERSITY   (China)

Author keywords

Adhesion improvement; Cubic boron nitride films; Plasma CVD; Post annealing; Stress relaxation

Indexed keywords

ADHESION IMPROVEMENT; CUBIC BORON NITRIDE FILMS; CUBIC PHASE; FILM ADHESION; INTERPLANAR DISTANCE; PEAK INTENSITY; PEAK SHIFTING; PLASMA CVD; POST ANNEALING; RESIDUAL COMPRESSIVE STRESS;

ADHESION; ANNEALING; BORON; COMPRESSIVE STRESS; PLASMA STABILITY; RESIDUAL STRESSES; STRESS RELAXATION; TENSILE STRESS;

CUBIC BORON NITRIDE;

EID: 80051789186     PISSN: 09259635     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.diamond.2011.07.003     Document Type: Article

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