Synthesis of cubic boron nitride films using a helicon wave plasma and reduction of compressive stress

Thin Solid Films

Volumn 290-291, Issue , 1996, Pages 120-125

  Kim, Ig Hyeon ^a   Kim, Ki Sung ^a   Kim, Seon Hyo ^a   Lee, Sang Ro ^b  

^a Pohang University of Science and Technology (POSTECH)   (South Korea)

^b Korea Institute of Machine and Materials   (South Korea)

Author keywords

Boron nitride; Helicon wave plasma; Phase transformation

Indexed keywords

ADHESION; FILM GROWTH; FOURIER TRANSFORM INFRARED SPECTROSCOPY; ION BOMBARDMENT; PHASE TRANSITIONS; PLASMA DENSITY; RESIDUAL STRESSES; STRESS RELAXATION; SYNTHESIS (CHEMICAL); THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY; WAVE PLASMA INTERACTIONS;

HELICON WAVE PLASMA;

CUBIC BORON NITRIDE;

EID: 0030408643     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(96)09194-8     Document Type: Article

References (26)

1. S. Fahy, Phys. Rev. B, 51 (1995) 12873.
2. H. Ehrhardt, Surf. Coat. Technol., 74/75 (1995) 29.
3. D.S. Zhou, C.L. Chen, T.E. Mitohell, L.B. Hackenberger and R. Messier, Philosophical Magazine Lett., 72/3 (1995) 163.
4. Y. Ichinose, H. Saitoh and Y. Hirotsu, Surf. Coat. Technol., 43/44 (1990) 116.
5. H. Hofsäss, C. Ronning, V. Griemeire and M. Gorss, Appl. Phys. Lett., 67 (1995) 460.
6. S. Mineta and N. Yasunaga, Thin Solid Films, 189 (1990) 125.
7. E.H. Lee and H. Poppa, J. Vac. Sci. Technol., 14 (1977) 223.
8. M. Mieno and T. Yoshida, Jpn. J. Appl. Phys., 29/7 (1990) L1175.
9. K.L. Chopra, V. Agarwal, V.D. Vankar, C.D. Deshpandey and R.F. Bunshah, Thin Solid Films, 120 (1985) 307.
10. S. Shanfield and R. Wolfson, J. Vac. Sci. Technol., A 1(2) (1993) 323.
11. M. Sueda, T. Kobayashi, H. Tsukamoto, T. Rokkaku, Y. Fukaya, N. Yamashita and T. Wada, Thin Solid Films, 228 (1993) 97.
12. K. Kaneda and K. Shibata, Jpn. J. Appl. Phys., 33 (1994) 2661.
13. P.B. Mirkarimi, D.L. Medlin and K.F. McCarty, Appl. Phys. Lett., 66 (1995) 2813.
14. M. Nastssi and J.W. Mayer, Mat. Sci. Rep., 6 (1991) 1.
15. C.A. Davis, Thin Solid Films, 226 (1993) 30.
16. T.A. Friedmann, J. Appl. Phys., 76 (1994) 3088.
17. S. Reinke, M. Kura and W. Kulisch, Diam. Relat. Mater., 3 (1994) 431.
18. A.J. Perry, D. Vender and R.W. Boswell, J. Vac. Sci. Technol., B 9 (1991) 310.
19. R.W. Boswell, Plasma Phys. and Controlled Fusion, 26 (1984) 1147.
20. F.F. Chen and C.D. Decker, Plasma Phys. and Controlled Fusion, 34 (1992) 635.
21. S. Shanfield and R. Wolfson, J. Vac. Sci. Technol., A 1 (1983) 323.
22. G.G. Stoney, Pro. R. Soc., A 82 (1909) 171.
23. S.P.S. Arya and A. D'Amico, Thin Solid Films, 157 (1988) 267.
24. C.R. Eddy and B.D. Sartwell, J. Vac. Sci. Technol., A 13 (1995) 2018.
25. H. Windischmann, J. Vac. Sci. Technol., A 9 (1991) 2431.
26. D.R. McKenzie, W.D. Mcfall, S. Reisch, B.W. James, I.S. Falconer, R.W. Boswell, H. Persing, A.J. Perry and A. Durandet, Surface and Coatings Technology, 78 (1996) 255.