|
Volumn 341, Issue 1, 1999, Pages 238-245
|
Reduction of intrinsic stress in cubic boron nitride films
|
Author keywords
[No Author keywords available]
|
Indexed keywords
ADHESION;
COMPRESSIVE STRESS;
CUBIC BORON NITRIDE;
DEPOSITION;
ELECTRON ENERGY LEVELS;
FILM PREPARATION;
ION BOMBARDMENT;
ION IMPLANTATION;
IONS;
TEMPERATURE;
THERMAL STRESS;
INTRINSIC STRESS;
STRESS REDUCTION;
THIN FILMS;
|
EID: 0032674370
PISSN: 00406090
EISSN: None
Source Type: Journal
DOI: 10.1016/S0040-6090(98)01766-0 Document Type: Article |
Times cited : (45)
|
References (50)
|