Growth behavior of intermetallic compounds at SnAgCu/Ni and Cu interfaces

Journal of Materials Engineering and Performance

Volumn 19, Issue 1, 2010, Pages 129-134

  Qi, Lihua ^a   Huang, Jihua ^a   Zhang, Hua ^a   Zhao, Xingke ^a   Wang, Haitao ^a   Cheng, Donghai ^a  

^a UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING   (China)

Author keywords

Ag 3Sn; Growth behavior; Intermetallic compound (IMC); Sn3.5Ag0.5Cu solder; Thermal shear cycling

Indexed keywords

CU SUBSTRATE; CYCLING CONDITIONS; CYCLING PROCESS; CYCLING TIME; GROWTH BEHAVIOR; INTERMETALLIC COMPOUNDS; ISOTHERMAL AGING; MECHANISM OF FORMATION; SNAGCU SOLDER;

SEMICONDUCTING INTERMETALLICS; SILVER; SOLDERING ALLOYS;

TIN;

EID: 75949091469     PISSN: 10599495     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11665-009-9423-9     Document Type: Article

References (17)

1. J.Y. Tsai and C.R. Kao, The Effect of Ni on the Interfacial Reaction Between Sn-Ag Solder and Cu Metallization, Proceedings of the 4th International Symposium on Electronic Materials and Packaging Conference (Taiwan, China), IEEE Press, 2002, p 271-276
2. Y.S. Kim K.S. Kim C.W. Hwang, et al. 2003 Effect of Composition and Cooling Rate on Microstructure and Tensile Properties of Sn-Zn-Bi Alloys J. Alloys Compd. 352 3 237 245 10.1016/S0925-8388(02)01168-4 1:CAS:528: DC%2BD3sXitlerurc%3D 1985277
3. X. Ma F.J. Wang Y.Y. Qian, et al. 2003 Development of Cu-Sn Intermetallic Compound at Pb-Free Solder/Cu Joint Interface Mater. Lett. 57 22-23 3361 3365 10.1016/S0167-577X(03)00075-2 1:CAS:528:DC%2BD3sXkvFyqsbs%3D
4. K.S. Kim J.M. Yang C.H. Yu I.O. Jung, et al. 2004 Analysis on Interfacial Reactions Between Sn-Zn Solders and the Au/Ni Electrolytic-Plated Cu Pad J. Alloys Compd. 379 1/2 314 318 10.1016/j.jallcom.2004.03.138 1:CAS:528: DC%2BD2cXntlSksLY%3D
5. C.L. Wei and C.R. Kao, Liquid/Solid and Solid/Solid Reactions Between SnAgCu Lead-Free Solders and Ni Surface Finish, Proceedings of the 4th International Symposium on Electronic Materials and Packaging Conference (Taiwan, China), IEEE Press, 2002, p 330-334
6. C.M. Chang, P.C. Shi, and K.L. Lin, Interfacial Reaction Between Sn-Ag-Cu, Sn-Ag-Cu-Ni-Ge Lead-Free Solders and Metallic Substrates, Proceedings of the 4th International Symposium on Electronic Materials and Packaging Conference (Taiwan, China), IEEE Press, 2002, p 360-366
7. H.L.J. Pang K.H. Tan X.Q. Shi Z.P. Wang 2001 Microstructure and Intermetallic Growth Effects on Shear and Fatigue Strength of Solder Joints Subjected to Thermal Cycling Aging Mater. Sci. Eng. A 307 42 50 10.1016/S0921-5093(00)01958-4 (Pubitemid 32430847)
8. A. Sharif Y.C. Chan M.N. Islam M.J. Rizvi 2005 Effect of Indium Addition in Sn-Rich Solder on the Dissolution of Cu Metallization J. Alloys Compd. 388 75 82 10.1016/j.jallcom.2004.07.015 1:CAS:528:DC%2BD2MXksFOlsg%3D%3D (Pubitemid 40073362)
9. S. Wiese F. Feustel E. Meusel 2002 Characterisation of Constitutive Behaviour of SnAg, SnAgCu and SnPb Solder in Flip Chip Joints Sens. Actuators A 99 188 193 10.1016/S0924-4247(01)00880-9 (Pubitemid 34684712)
10. K.H. Prakash T. Sritharan 2001 Interface Reaction Between Copper, Molten Tin-Lead Solders Acta Mater. 49 2481 2489 10.1016/S1359-6454(01)00146-X 1:CAS:528:DC%2BD3MXkvFyju7w%3D (Pubitemid 32621520)
11. O. Fouassier J. Chazelas J.F. Silvain 2002 Conception of a Consumable Copper Reaction Zone for a NiTi/SnAgCu Compos. Mater. A 33 1391 1395
12. L. Qin J. Zhao L. Wang, et al. 2004 Microstructure Evolution in Lead-Free Solder Joints After Wave Soldering and Reflow Soldering Electron. Process Technol. 25 2 64 67 1:CAS:528:DC%2BD2MXjt1Olsrc%3D
13. H.L.J. Pang T.H. Low B.S. Xiong, et al. 2004 Thermal Cycling Aging Effects on Sn-Ag-Cu Solder Joint Microstructure, IMC and strength Thin Solid Films 462-463 370 375 10.1016/j.tsf.2004.05.092
14. I. Dutta D. Pan R.A. Marks, et al. 2005 Effect of Thermo-Mechanically Induced Microstructural Coarsening on the Evolution of Creep Response of SnAg-Based Microelectronic Solders Mater. Sci. Eng. A 410-411 25 48 52
15. J. Zhao Y. Miyashita Y. Mutoh 2001 Fatigue Crack Growth Behavior of 96.5Sn-3.5Ag Lead-Free Solder Int. J. Fatigue 23 723 731 10.1016/S0142-1123(01) 00034-2 1:CAS:528:DC%2BD3MXlt1Siu78%3D
16. 3Sn Plate Formation in the Solidification of Near Ternary Eutectic Sn-Ag-Cu Alloys J. Mater. Res. 17 2775 2778 10.1557/JMR.2002.0402 1:CAS:528:DC%2BD38XosF2ju7o%3D 2002JMatR..17.2775H
17. K.S. Kim S.H. Huh K. Suganuma 2003 Effect of Intermetallic Compounds on Properties of Sn-Ag-Cu Lead-Free Soldered Joints J. Alloys Compd. 352 226 236 10.1016/S0925-8388(02)01166-0 1:CAS:528:DC%2BD3sXitlert7g%3D