메뉴 건너뛰기




Volumn 21, Issue 12, 2011, Pages 2273-2281

Towards integrated molecular electronic devices: Characterization of molecular layer integrity during fabrication processes

Author keywords

buried interface; modified surfaces; molecular electronics; nanotechnology; spectroscopy

Indexed keywords

AFM; AROMATIC MOLECULES; BURIED INTERFACE; CARBON-CARBON BONDING; DEPOSITED METAL; DIAZONIUM REDUCTION; DIRECT DEPOSITION; DIRECT-EVAPORATION; ETCHING SOLUTIONS; FABRICATION PROCESS; HIGH YIELD; IN-VACUUM; MINIMAL EFFECTS; MODIFIED SURFACES; MOLECULAR ELECTRONIC DEVICE; MOLECULAR ELECTRONIC JUNCTION; MOLECULAR JUNCTION; MOLECULAR LAYER; NITROAZOBENZENE; PARTIAL PENETRATION; PARYLENE-N; PROCESSING VARIABLES; PT DEPOSITION; TOP CONTACT;

EID: 79959501868     PISSN: 1616301X     EISSN: 16163028     Source Type: Journal    
DOI: 10.1002/adfm.201002496     Document Type: Article
Times cited : (36)

References (62)
  • 1
    • 79959514929 scopus 로고    scopus 로고
    • Semiconductor Industry Association,. Accessed September, 2010
    • Semiconductor Industry Association,. Accessed September, 2010


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.