Soft Au, Pt and Cu contacts for molecular junctions through surface-diffusion-mediated deposition

Nature Nanotechnology

Volumn 5, Issue 8, 2010, Pages 612-617

  Bonifas, Andrew P ^a,b   McCreery, Richard L ^b,c  

^a Ohio State University   (United States)

^b NATIONAL RESEARCH COUNCIL CANADA   (Canada)

^c UNIVERSITY OF ALBERTA   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

METALS; SURFACE DIFFUSION;

METAL ATOMS; METALLIC CONTACTS; MOLECULAR DEVICE; MOLECULAR ELECTRONIC DEVICE; MOLECULAR JUNCTION; MOLECULAR LAYER; REPRODUCIBILITIES; VAPOUR DEPOSITION;

VAPOR DEPOSITION;

COPPER; GOLD; PLATINUM;

ARTICLE; ATOM; DIFFUSION; MOLECULAR DYNAMICS; MOLECULAR ELECTRONICS; PRIORITY JOURNAL; SURFACE DIFFUSION MEDIATED DEPOSITION;

EID: 77956448704     PISSN: 17483387     EISSN: 17483395     Source Type: Journal    
DOI: 10.1038/nnano.2010.115     Document Type: Article

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