High-throughput characterization of mechanical properties of Ti-Ni-Cu shape memory thin films at elevated temperature

Materials Science and Engineering: A

Volumn 528, Issue 21, 2011, Pages 6552-6557

  Zarnetta, R ^a   Kneip, S ^a   Somsen, C ^a   Ludwig, A ^a  

^a RUHR UNIVERSITY BOCHUM   (Germany)

Author keywords

Combinatorial materials science; Hardness measurements; Martensitic transformation; Nanoinwdentation; Precipitation; Shape memory alloys

Indexed keywords

COPPER ALLOYS; ELASTIC MODULI; GRAIN REFINEMENT; HARDNESS; NANOINDENTATION; PRECIPITATES; PRECIPITATION (CHEMICAL); SHAPE MEMORY EFFECT; TERNARY ALLOYS; THIN FILMS; THROUGHPUT; TITANIUM ALLOYS;

COMBINATORIAL MATERIALS SCIENCE; ELEVATED TEMPERATURE; HARDNESS MEASUREMENT; HIGH THROUGH-PUT CHARACTERIZATION; NANOINDENTATION EXPERIMENTS; NANOINWDENTATION; PRECIPITATE PHASIS; THIN-FILMS; TI-NI-CU; YOUNG MODULUS;

MARTENSITIC TRANSFORMATIONS;

EID: 79959343563     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2011.05.006     Document Type: Article

References (61)

1. Benard W.L., Kahn H., Heuer A.H., Huff M.A. J. Microelectromech. Syst. 1998, 7:245-251.
2. Makino E., Mitsuya T., Shibata T. Sens. Actuators Phys. 2001, 88:256-262.
3. Shin D.D., Mohanchandra K.P., Carman G.P. Sens. Actuators Phys. 2005, 119:151-156.
4. Xu D., Wang L., Ding G., Zhou Y., Yu A., Cai B. Sens. Actuators Phys. 2001, 93:87-92.
5. Kohl M., Dittmann D., Quandt E., Winzek B. Sens. Actuators Phys. 2000, 83:214-219.
6. Liu Y., Kohl M., Okutsu K., Miyazaki S. Mater. Sci. Eng. A 2004, 378:205-209.
7. Lee A.P., Ciarlo D.R., Krulevitch P.A., Lehew S., Trevino J., Northrup M.A. Sens. Actuators Phys. 1996, 54:755-759.
8. Bellouard Y. Mater. Sci. Eng. A 2008, 481-482:582-589.
9. Gill J.J., Chang D.T., Momoda L.A., Carman G.P. Sens. Actuators Phys. 2001, 93:148-156.
10. Fu Y.Q., Luo J.K., Ong S.E., Zhang S., Flewitt A.J., Milne W.I. J. Micromech. Microeng. 2008, 18:35026.
11. Fu Y., Luo J.K., Hu M., Du H.J., Flewitt A.J., Milne W.I. J. Micromech. Microeng. 2005, 15:1872-1877.
12. Vitushinsky R., Schmitz S., Ludwig A. J. Microelectromech. Syst. 2009, 18:186-194.
13. Krulevitch P., Lee A.P., Ramsey P.B., Trevino J.C., Hamilton J., Northrup M.A. J. Microelectromech. Syst. 1996, 5:270-282.
14. Miyazaki S., Ishida A. Mater. Sci. Eng. A 1999, 273-275:106-133.
15. Löbel R., Thienhaus S., Savan A., Ludwig A. Mater. Sci. Eng. A 2008, 481-482:151-155.
16. Zarnetta R., Savan A., Thienhaus S., Ludwig A. Appl. Surf. Sci. 2007, 254:743-748.
17. Sanjabi S., Sadrnezhaad S.K., Barber Z.H. Mater. Sci. Technol. 2007, 23:987-991.
18. König D., Zarnetta R., Savan A., Brunken H., Ludwig A. Acta Mater. 2011, 59:3267-3275.
19. Kim H.Y., Mizutani M., Miyazaki S. Acta Mater. 2009, 57:1920-1930.
20. Zarnetta R., Ehmann M., Savan A., Ludwig A. Smart Mater. Struct. 2010, 19:65032.
21. Oliver W.C., Pharr G.M. J. Mater. Res. 1992, 7:1564-1583.
22. Vlassak J.J., Nix W.D. J. Mater. Res. 1992, 7:3242-3249.
23. Xiang Y., Chen X., Vlassak J.J. J. Mater. Res. 2005, 20:2360-2370.
24. Hemker K.J., Sharpe W.N. Annu. Rev. Mater. Res. 2007, 37:93-126.
25. Gaspar J., Schmidt M.E., Held J., Paul O. IEEE ASME J. Microelectromech. Syst. 2009, 18:1062-1076.
26. Oliver W.C., Pharr G.M. J. Mater. Res. 2004, 19:3-20.
27. Fischer-Cripps A.C. Surf. Coat. Technol. 2006, 200:4153-4165.
28. Warren O.L., Dwivedi A., Wyrobek T.J., Famodu O.O., Takeuchi I. Rev. Sci. Instrum. 2005, 76:062209-6.
29. Warren O.L., Wyrobek T.J. Meas. Sci. Technol. 2005, 16:100-110.
30. Han S.M., Shah R., Banerjee R., Viswanathan G.B., Clemens B.M., Nix W.D. Acta Mater. 2005, 53:2059-2067.
31. Dwivedi A., Wyrobek T.J., Warren O.L., Hattrick-Simpers J., Famodu O.O., Takeuchi I. J. Appl. Phys. 2008, 104:73501.
32. Ludwig A., Zarnetta R., Hamann S., Savan A., Thienhaus S. Int. J. Mater. Res.: Z. Metallkd. 2008, 99:1144-1149.
33. Lehnert T., Tixier S., Boni B., Gotthardt R. Mater. Sci. Eng. A 1999, 273:713-716.
34. Lehnert T., Grimmer H., Böni P., Horisberger M., Gotthardt R. Acta Mater. 2000, 48:4065-4071.
35. Yaakoubi N., Serre C., Martinez S., Perez-Rodriguez A., Morante J.R., Esteve J., Montserrat J., Dufour-Gergam E., Granchamp J.P., Bosseboeuf A., Frantz-Rodriguez N. J. Mater. Sci. Mater. Electron. 2001, 12:323-326.
36. Cho H., Kim H.Y., Miyazaki S. Sci. Technol. Adv. Mater. 2005, 6:678-683.
37. Cho H., Kim H.Y., Miyazaki S. Mater. Sci. Eng. A 2006, 438-440:699-702.
38. Pfetzing-Micklich J., Wagner M.F.X., Zarnetta R., Frenzel J., Eggeler G., Markaki A.E., Wheeler J., Clyne T.W. Adv. Eng. Mater. 2010, 12:13-19.
39. Kim M.T. Thin Solid Films 1996, 283:12-16.
40. Bhushan B., Li X. J. Mater. Res. 1997, 12:54-63.
41. Ishida A., Sato M., Ogawa K. Mater. Sci. Eng. A 2008, 481-482:91-94.
42. Chang L., Grummon D.S. Philos. Mag. A 1997, 76:191-219.
43. Nishida M., Ueda T., Toyama Y., Chiba A. Mater. Sci. Forum 1990, 56-58:599-604.
44. Fukuda T., Kitayama M., Kakeshita T., Saburi T. Mater. Trans. JIM 1996, 37:1540-1546.
45. Ishida A., Sato M., Takei A., Nomura K., Miyazaki S. Metall. Mater. Trans. 1996, 27:3753-3759.
46. Hsieh S.F., Wu S.K. J. Mater. Sci. 1997, 32:989-996.
47. Shimizu S., Xu Y., Okunishi E., Tanaka S., Otsuka K., Mitose K. Mater. Lett. 1998, 34:23-29.
48. Sawaguchi T., Sato M., Ishida A. Mater. Sci. Eng. A 2002, 332:47-55.
49. Ishida A., Sato M., Ogawa K. Philos. Mag. 2008, 88:2427-2438.
50. Sawaguchi T., Sato M., Ishida A. Metall. Mater. Trans. 2004, 35A:111-119.
51. Fukuda T., Kakeshita T., Saburi T. Mater. Trans. JIM 2000, 41:837-840.
52. R. Zarnetta, A. Savan, S. Thienhaus, A. Ludwig, Intermetallics (2011) submitted for publication.
53. Rajagopalan S., Little A.L., Bourke M.A.M., Vaidyanathan R. Appl. Phys. Lett. 2005, 86:81901-81903.
54. Tall P.D., Ndiaye S., Beye A.C., Zong Z., Soboyejo W.O., Lee H.J., Ramirez A.G., Rajan K. Mater. Manuf. Process. 2007, 22:175-179.
55. Raju K.S.S.E., Bysakh S., Sumesh M.A., Kamat S.V., Mohan S. Mater. Sci. Eng. A 2008, 476:267-273.
56. Liu K.T., Duh J.G. Surf. Coat. Technol. 2008, 202:2737-2742.
57. Huang X., Ramirez A.G. Appl. Phys. Lett. 2009, 95:121911-121913.
58. Wagner M.F.X., Windl W. Acta Mater. 2008, 56:6232-6245.
59. Timoshenko S. J. Opt. Soc. Am. 1925, 11:233-256.
60. Okada Y., Tokumaru Y. J. Appl. Phys. 1984, 56:314-320.
61. Uchil J., Mohanchandra K.P., Ganesh K.K., Mahesh K.K., Murali T.P. Phys. B: Condens. Matter 1999, 270:289-297.