Microstructure of annealed Ti48.5Ni(51.5-x)Cu x (x = 6.2-33.5) thin films

Philosophical Magazine

Volumn 88, Issue 16, 2008, Pages 2427-2438

  Ishida, A ^a   Sato, M ^a   Ogawa, K ^a  

^a NATIONAL INSTITUTE FOR MATERIALS SCIENCE   (Japan)

Author keywords

Annealing; Microstructural characterization; Shape memory alloys; Sputtering; Thin films; Ti Ni Cu

Indexed keywords

ANNEALING; COPPER; COPPER ALLOYS; GRAIN (AGRICULTURAL PRODUCT); MICROSTRUCTURE; NICKEL; NICKEL ALLOYS; PRECIPITATES; STEEL METALLOGRAPHY;

ANNEALED FILMS; ANNEALING TEMPERATURE; CU CONTENT; GRAIN BOUNDARIES; GRAIN INTERIORS; GRAIN SIZES; GRAIN-BOUNDARY PRECIPITATES; MICROSTRUCTURAL CHARACTERIZATION; SHAPE MEMORY ALLOYS; SPUTTERING; THIN FILMS; TI-NI-CU; TWO TYPES;

AMORPHOUS FILMS;

EID: 52949150412     PISSN: 14786435     EISSN: 14786443     Source Type: Journal    
DOI: 10.1080/14786430802350694     Document Type: Article

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