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Journal of Vacuum Science and Technology B

Volumn 29, Issue 3, 2011, Pages

Comprehensive comparison of electrical and reliability characteristics of various copper barrier films

(5) Cheng, Yi Lung a Wu, Jiung a Chiu, Tai Jung a Chen, Shiuan An a Wang, Ying Lang a

a NATIONAL CHI NAN UNIVERSITY (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC MATERIALS; DOPING (ADDITIVES); NITROGEN; RELIABILITY; SILICON CARBIDE; SILICON NITRIDE; SILICON OXIDES;

BARRIER FILMS; COMPREHENSIVE COMPARISONS; ELECTRICAL AND RELIABILITY CHARACTERISTICS; ELECTRICAL PERFORMANCE; NITROGEN-DOPED; OXYGEN-DOPED; RELIABILITY CHARACTERISTICS; STRESS MIGRATION;

COPPER;

EID: 79958140469 PISSN: 21662746 EISSN: 21662754 Source Type: Journal
DOI: 10.1116/1.3591340 Document Type: Article

Times cited : (16)

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