Damage of low-k and ultralow-k dielectrics from reductive plasma discharges used for photoresist removal

Journal of the Electrochemical Society

Volumn 152, Issue 7, 2005, Pages

  Moore, Darren L ^a   Carter, Richard J ^a   Cui, Hao ^a   Burke, Peter ^a   Gu, S Q ^a   Peng, Huagen ^b   Valley, Richard S ^b   Gidley, David W ^b   Waldfried, Carlo ^c   Escorcia, Orlando ^c  

^a AGERE SYSTEMS   (United States)

^b UNIVERSITY OF MICHIGAN   (United States)

^c AXCELIS TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DENSIFICATION; DESORPTION; FOURIER TRANSFORM INFRARED SPECTROSCOPY; INTEGRATED CIRCUITS; PERMITTIVITY; PHOTORESISTS; POROSITY; POROUS MATERIALS; REACTIVE ION ETCHING; SILICON COMPOUNDS;

DAMAGING EFFECT; PHOTORESIST REMOVAL; PLASMA DISCHARGES; SURFACE DENSIFICATION;

DIELECTRIC MATERIALS;

EID: 23744506544     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1921848     Document Type: Article

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