Low dielectric constant a-SiOC:H films as copper diffusion barrier

Journal of Applied Physics

Volumn 93, Issue 2, 2003, Pages 1241-1245

  Koh, Yee Wee ^a   Loh, Kian Ping ^a   Rong, Liu ^a   Wee, A T S ^a   Huang, Liu ^b   Sudijono, J ^b  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b CHARTERED SEMICONDUCTOR MANUFACTURING LTD   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITION; COPPER; DIELECTRIC FILMS; DIFFUSION; FOURIER TRANSFORM INFRARED SPECTROSCOPY; PERMITTIVITY; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SECONDARY ION MASS SPECTROMETRY; SILICON CARBIDE;

DIELECTRIC BARRIER;

AMORPHOUS FILMS;

EID: 0037439576     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1530722     Document Type: Article

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