Influences of atomic hydrogen on porous low-k dielectric for 45-nm node

Thin Solid Films

Volumn 515, Issue 12, 2007, Pages 5031-5034

  Tomioka, K ^a   Soda, E ^a   Kobayashi, N ^a   Takata, M ^b   Uda, S ^b   Ogushi, K ^b   Yuba, Y ^b   Akasaka, Y ^b  

^a SEMICONDUCTOR LEADING EDGE TECHNOLOGIES INC   (Japan)

^b OSAKA UNIVERSITY   (Japan)

Author keywords

Ash; Catalyzer; Hydrogen; Low k

Indexed keywords

CATALYSTS; NANOELECTRONICS; PERMITTIVITY; POROUS MATERIALS;

ATOMIC HYDROGEN; CATALYZERS; DAMAGED LOW-K DIELECTRICS; DAMAGELESS ASH; METHYL SILSESQUIOXANE;

DIELECTRIC MATERIALS;

EID: 33947100379     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2006.10.080     Document Type: Article

References (5)

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