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Volumn 21, Issue 6, 2011, Pages

A razor-blade test of the demolding energy in a thermoplastic embossing process

Author keywords

[No Author keywords available]

Indexed keywords

AREAL DENSITIES; CIRCULAR POSTS; DEMOLDING; FLUOROPOLYMER COATING; MECHANICAL WORK; QUICK TESTS; SEMI-CONDUCTOR WAFER; SILICON MOLDS; WORK OF FRACTURE;

EID: 79957960484     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/21/6/067002     Document Type: Article
Times cited : (15)

References (28)
  • 1
    • 4644305938 scopus 로고    scopus 로고
    • New aspects of simulation in hot embossing
    • Worgull M and Heckele M 2004 New aspects of simulation in hot embossing Microsyst. Technol. 10 432-7
    • (2004) Microsyst. Technol. , vol.10 , Issue.5 , pp. 432-437
    • Worgull, M.1    Heckele, M.2
  • 2
    • 33748539687 scopus 로고    scopus 로고
    • Modeling and optimization of the hot embossing process for micro-and nanocomponent fabrication
    • Worgull M, Heckele M, Hetu J F and Kabanemi K K 2006 Modeling and optimization of the hot embossing process for micro-and nanocomponent fabrication J. Microlithogr. Microfabr. Microsyst. 5 011005
    • (2006) J. Microlithogr. Microfabr. Microsyst. , vol.5 , Issue.1 , pp. 011005
    • Worgull, M.1    Heckele, M.2    Hetu, J.F.3    Kabanemi, K.K.4
  • 3
    • 0036502497 scopus 로고    scopus 로고
    • Hot embossing in microfabrication. Part II: Rheological characterization and process analysis
    • DOI 10.1002/pen.10971
    • Juang Y-J, Lee L J and Koelling K W 2002 Hot embossing in microfabrication: part II. Rheological characterization and process analysis Polym. Eng. Sci. 42 551-66 (Pubitemid 34269238)
    • (2002) Polymer Engineering and Science , vol.42 , Issue.3 , pp. 551-566
    • Juang, Y.-J.1    Lee James, L.2    Koelling, K.W.3
  • 4
    • 67849092525 scopus 로고    scopus 로고
    • A computationally simple method for simulating the micro-embossing of thermoplastic layers
    • Taylor H, Lam Y C and Boning D 2009 A computationally simple method for simulating the micro-embossing of thermoplastic layers J. Micromech. Microeng. 19 075007
    • (2009) J. Micromech. Microeng. , vol.19 , Issue.7 , pp. 075007
    • Taylor, H.1    Lam, Y.C.2    Boning, D.3
  • 5
    • 77952331155 scopus 로고    scopus 로고
    • A method for the accelerated simulation of micro-embossed topographies in thermoplastic polymers
    • Taylor H, Hale M, Lam Y C and Boning D 2010 A method for the accelerated simulation of micro-embossed topographies in thermoplastic polymers J. Micromech. Microeng. 20 065001
    • (2010) J. Micromech. Microeng. , vol.20 , Issue.6 , pp. 065001
    • Taylor, H.1    Hale, M.2    Lam, Y.C.3    Boning, D.4
  • 6
    • 44249101417 scopus 로고    scopus 로고
    • Computationally efficient modelling of pattern dependencies in the micro-embossing of thermoplastic polymers
    • Taylor H, Boning D, Iliescu C and Chen B 2008 Computationally efficient modelling of pattern dependencies in the micro-embossing of thermoplastic polymers Microelectron. Eng. 85 1453-6
    • (2008) Microelectron. Eng. , vol.85 , Issue.5-6 , pp. 1453-1456
    • Taylor, H.1    Boning, D.2    Iliescu, C.3    Chen, B.4
  • 7
    • 78650901367 scopus 로고    scopus 로고
    • An investigation of the detrimental impact of trapped air in thermoplastic micro-embossing
    • Taylor H, Lam Y C and Boning D 2010 An investigation of the detrimental impact of trapped air in thermoplastic micro-embossing J. Micromech. Microeng. 20 065014
    • (2010) J. Micromech. Microeng. , vol.20 , Issue.6 , pp. 065014
    • Taylor, H.1    Lam, Y.C.2    Boning, D.3
  • 9
    • 33947588123 scopus 로고    scopus 로고
    • Study of the demolding process - Implications for thermal stress, adhesion and friction control
    • DOI 10.1088/0960-1317/17/1/002, PII S096013170733831X, 002
    • Guo Y, Liu G, Xiong Y and Tian Y 2007 Study of the demolding process-implications for thermal stress, adhesion and friction control J. Micromech. Microeng. 17 9-19 (Pubitemid 46476582)
    • (2007) Journal of Micromechanics and Microengineering , vol.17 , Issue.1 , pp. 9-19
    • Guo, Y.1    Liu, G.2    Xiong, Y.3    Tian, Y.4
  • 11
    • 0942300907 scopus 로고    scopus 로고
    • Polymer embossing tools for rapid prototyping of plastic microfluidic devices
    • Narasimhan J and Papautsky I 2004 Polymer embossing tools for rapid prototyping of plastic microfluidic devices J. Micromech. Microeng. 14 96-103
    • (2004) J. Micromech. Microeng. , vol.14 , Issue.1 , pp. 96-103
    • Narasimhan, J.1    Papautsky, I.2
  • 12
    • 78651505715 scopus 로고    scopus 로고
    • Hot embossing of plastic microfluidic devices using poly(dimethylsiloxane) molds
    • Goral V N, Hsieh Y, Petzold O N, Faris R A and Yuen P K 2011 Hot embossing of plastic microfluidic devices using poly(dimethylsiloxane) molds J. Micromech. Microeng. 21 017002
    • (2011) J. Micromech. Microeng. , vol.21 , Issue.1 , pp. 017002
    • Goral, V.N.1    Hsieh, Y.2    Petzold, O.N.3    Faris, R.A.4    Yuen, P.K.5
  • 13
    • 70350625109 scopus 로고    scopus 로고
    • Metallic glasses: Viable tool materials for the production of surface microstructures in amorphous polymers by micro-hot-embossing
    • Henann D L, Srivastava V, Taylor H K, Hale M R, Hardt D E and Anand L 2009 Metallic glasses: viable tool materials for the production of surface microstructures in amorphous polymers by micro-hot-embossing J. Micromech. Microeng. 19 115030
    • (2009) J. Micromech. Microeng. , vol.19 , Issue.11 , pp. 115030
    • Henann, D.L.1    Srivastava, V.2    Taylor, H.K.3    Hale, M.R.4    Hardt, D.E.5    Anand, L.6
  • 14
    • 77950291382 scopus 로고    scopus 로고
    • Microstructured metal molds fabricated via investment casting
    • Cannon A H and King W P 2010 Microstructured metal molds fabricated via investment casting J. Micromech. Microeng. 20 025025
    • (2010) J. Micromech. Microeng. , vol.20 , Issue.2 , pp. 025025
    • Cannon, A.H.1    King, W.P.2
  • 17
    • 65149087927 scopus 로고    scopus 로고
    • Plasma fluorination of diamond-like carbon surfaces: Mechanism and application to nanoimprint lithography
    • Schvartzman M and Wind S J 2009 Plasma fluorination of diamond-like carbon surfaces: mechanism and application to nanoimprint lithography Nanotechnology 20 145306
    • (2009) Nanotechnology , vol.20 , Issue.14 , pp. 145306
    • Schvartzman, M.1    Wind, S.J.2
  • 22
    • 42549084800 scopus 로고    scopus 로고
    • Quantitative characterizations of a nanopatterned bonded wafer: Force determination for nanoimprint lithography stamp removal
    • Landis S, Chaix N, Gourgon C and Leveder T 2008 Quantitative characterizations of a nanopatterned bonded wafer: force determination for nanoimprint lithography stamp removal Nanotechnology 19 125305
    • (2008) Nanotechnology , vol.19 , Issue.12 , pp. 125305
    • Landis, S.1    Chaix, N.2    Gourgon, C.3    Leveder, T.4
  • 25
    • 33847288208 scopus 로고    scopus 로고
    • Analysis of the demolding forces during hot embossing
    • DOI 10.1007/s00542-006-0225-9, HARMST, High Asprect Ratio Micro Structure Technology Workshop, Gyenogju, Korea, 10-13 June 2005 - part 2
    • Guo Y, Liu G, Zhu X and Tian Y 2007 Analysis of the demolding forces during hot embossing Microsyst. Technol. 13 411-5 (Pubitemid 46324413)
    • (2007) Microsystem Technologies , vol.13 , Issue.5-6 , pp. 411-415
    • Guo, Y.1    Liu, G.2    Zhu, X.3    Tian, Y.4
  • 26
    • 38149121497 scopus 로고    scopus 로고
    • PECVD amorphous silicon carbide membranes for cell culturing
    • Iliescu C, Chen B, Poenar D P and Lee Y Y 2008 PECVD amorphous silicon carbide membranes for cell culturing Sensors Actuators B 129 404-11
    • (2008) Sensors Actuators , vol.129 , Issue.1 , pp. 404-411
    • Iliescu, C.1    Chen, B.2    Poenar, D.P.3    Lee, Y.Y.4
  • 27
    • 0032753082 scopus 로고    scopus 로고
    • Characterization of a time multiplexed inductively coupled plasma etcher
    • Ayon A A, Braff R, Lin C C, Sawin H H and Schmidt M A 1999 Characterization of a time multiplexed inductively coupled plasma etcher J. Electrochem. Soc. 146 339-49
    • (1999) J. Electrochem. Soc. , vol.146 , Issue.1 , pp. 339-349
    • Ayon, A.A.1    Braff, R.2    Lin, C.C.3    Sawin, H.H.4    Schmidt, M.A.5
  • 28
    • 37849037295 scopus 로고    scopus 로고
    • Effects of patterning on the interface toughness of wafer-level Cu-Cu bonds
    • Tadepalli R, Turner K and Thompson C 2008 Effects of patterning on the interface toughness of wafer-level Cu-Cu bonds Acta Mater. 56 438-47
    • (2008) Acta Mater. , vol.56 , Issue.3 , pp. 438-447
    • Tadepalli, R.1    Turner, K.2    Thompson, C.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.