-
1
-
-
4644305938
-
New aspects of simulation in hot embossing
-
Worgull M and Heckele M 2004 New aspects of simulation in hot embossing Microsyst. Technol. 10 432-7
-
(2004)
Microsyst. Technol.
, vol.10
, Issue.5
, pp. 432-437
-
-
Worgull, M.1
Heckele, M.2
-
3
-
-
0036502497
-
Hot embossing in microfabrication. Part II: Rheological characterization and process analysis
-
DOI 10.1002/pen.10971
-
Juang Y-J, Lee L J and Koelling K W 2002 Hot embossing in microfabrication: part II. Rheological characterization and process analysis Polym. Eng. Sci. 42 551-66 (Pubitemid 34269238)
-
(2002)
Polymer Engineering and Science
, vol.42
, Issue.3
, pp. 551-566
-
-
Juang, Y.-J.1
Lee James, L.2
Koelling, K.W.3
-
4
-
-
67849092525
-
A computationally simple method for simulating the micro-embossing of thermoplastic layers
-
Taylor H, Lam Y C and Boning D 2009 A computationally simple method for simulating the micro-embossing of thermoplastic layers J. Micromech. Microeng. 19 075007
-
(2009)
J. Micromech. Microeng.
, vol.19
, Issue.7
, pp. 075007
-
-
Taylor, H.1
Lam, Y.C.2
Boning, D.3
-
5
-
-
77952331155
-
A method for the accelerated simulation of micro-embossed topographies in thermoplastic polymers
-
Taylor H, Hale M, Lam Y C and Boning D 2010 A method for the accelerated simulation of micro-embossed topographies in thermoplastic polymers J. Micromech. Microeng. 20 065001
-
(2010)
J. Micromech. Microeng.
, vol.20
, Issue.6
, pp. 065001
-
-
Taylor, H.1
Hale, M.2
Lam, Y.C.3
Boning, D.4
-
6
-
-
44249101417
-
Computationally efficient modelling of pattern dependencies in the micro-embossing of thermoplastic polymers
-
Taylor H, Boning D, Iliescu C and Chen B 2008 Computationally efficient modelling of pattern dependencies in the micro-embossing of thermoplastic polymers Microelectron. Eng. 85 1453-6
-
(2008)
Microelectron. Eng.
, vol.85
, Issue.5-6
, pp. 1453-1456
-
-
Taylor, H.1
Boning, D.2
Iliescu, C.3
Chen, B.4
-
7
-
-
78650901367
-
An investigation of the detrimental impact of trapped air in thermoplastic micro-embossing
-
Taylor H, Lam Y C and Boning D 2010 An investigation of the detrimental impact of trapped air in thermoplastic micro-embossing J. Micromech. Microeng. 20 065014
-
(2010)
J. Micromech. Microeng.
, vol.20
, Issue.6
, pp. 065014
-
-
Taylor, H.1
Lam, Y.C.2
Boning, D.3
-
9
-
-
33947588123
-
Study of the demolding process - Implications for thermal stress, adhesion and friction control
-
DOI 10.1088/0960-1317/17/1/002, PII S096013170733831X, 002
-
Guo Y, Liu G, Xiong Y and Tian Y 2007 Study of the demolding process-implications for thermal stress, adhesion and friction control J. Micromech. Microeng. 17 9-19 (Pubitemid 46476582)
-
(2007)
Journal of Micromechanics and Microengineering
, vol.17
, Issue.1
, pp. 9-19
-
-
Guo, Y.1
Liu, G.2
Xiong, Y.3
Tian, Y.4
-
11
-
-
0942300907
-
Polymer embossing tools for rapid prototyping of plastic microfluidic devices
-
Narasimhan J and Papautsky I 2004 Polymer embossing tools for rapid prototyping of plastic microfluidic devices J. Micromech. Microeng. 14 96-103
-
(2004)
J. Micromech. Microeng.
, vol.14
, Issue.1
, pp. 96-103
-
-
Narasimhan, J.1
Papautsky, I.2
-
12
-
-
78651505715
-
Hot embossing of plastic microfluidic devices using poly(dimethylsiloxane) molds
-
Goral V N, Hsieh Y, Petzold O N, Faris R A and Yuen P K 2011 Hot embossing of plastic microfluidic devices using poly(dimethylsiloxane) molds J. Micromech. Microeng. 21 017002
-
(2011)
J. Micromech. Microeng.
, vol.21
, Issue.1
, pp. 017002
-
-
Goral, V.N.1
Hsieh, Y.2
Petzold, O.N.3
Faris, R.A.4
Yuen, P.K.5
-
13
-
-
70350625109
-
Metallic glasses: Viable tool materials for the production of surface microstructures in amorphous polymers by micro-hot-embossing
-
Henann D L, Srivastava V, Taylor H K, Hale M R, Hardt D E and Anand L 2009 Metallic glasses: viable tool materials for the production of surface microstructures in amorphous polymers by micro-hot-embossing J. Micromech. Microeng. 19 115030
-
(2009)
J. Micromech. Microeng.
, vol.19
, Issue.11
, pp. 115030
-
-
Henann, D.L.1
Srivastava, V.2
Taylor, H.K.3
Hale, M.R.4
Hardt, D.E.5
Anand, L.6
-
14
-
-
77950291382
-
Microstructured metal molds fabricated via investment casting
-
Cannon A H and King W P 2010 Microstructured metal molds fabricated via investment casting J. Micromech. Microeng. 20 025025
-
(2010)
J. Micromech. Microeng.
, vol.20
, Issue.2
, pp. 025025
-
-
Cannon, A.H.1
King, W.P.2
-
15
-
-
32344453036
-
Antistick postpassivation of high-aspect ratio silicon molds fabricated by deep-reactive ion etching
-
DOI 10.1109/JMEMS.2005.863795
-
Gao J X, Yeo L P, Chan-Park M B, Miao J M, Yan Y H, Sun J B, Lam Y C and Yue C Y 2006 Antistick postpassivation of high-aspect ratio silicon molds fabricated by deep-reactive ion etching J. Microelectromech. Syst. 15 84-93 (Pubitemid 43216127)
-
(2006)
Journal of Microelectromechanical Systems
, vol.15
, Issue.1
, pp. 84-93
-
-
Gao, J.X.1
Yeo, L.P.2
Chan-Park, M.B.3
Miao, J.M.4
Yan, Y.H.5
Sun, J.B.6
Lam, Y.C.7
Yue, C.Y.8
-
16
-
-
70350623092
-
Anti-sticking behavior of DLC-coated silicon micro-molds
-
Saha B, Liu E, Tor S B, Khun N W, Hardt D E and Chun J H 2009 Anti-sticking behavior of DLC-coated silicon micro-molds J. Micromech. Microeng. 19 105025
-
(2009)
J. Micromech. Microeng.
, vol.19
, Issue.10
, pp. 105025
-
-
Saha, B.1
Liu, E.2
Tor, S.B.3
Khun, N.W.4
Hardt, D.E.5
Chun, J.H.6
-
17
-
-
65149087927
-
Plasma fluorination of diamond-like carbon surfaces: Mechanism and application to nanoimprint lithography
-
Schvartzman M and Wind S J 2009 Plasma fluorination of diamond-like carbon surfaces: mechanism and application to nanoimprint lithography Nanotechnology 20 145306
-
(2009)
Nanotechnology
, vol.20
, Issue.14
, pp. 145306
-
-
Schvartzman, M.1
Wind, S.J.2
-
18
-
-
17344382000
-
Anti-adhesive layers on nickel stamps for nanoimprint lithography
-
Park S, Schift H, Padeste C, Schnyder B, Kotz R and Gobrecht J 2004 Anti-adhesive layers on nickel stamps for nanoimprint lithography Microelectron. Eng. 73-74 196-201
-
(2004)
Microelectron. Eng.
, vol.73-74
, pp. 196-201
-
-
Park, S.1
Schift, H.2
Padeste, C.3
Schnyder, B.4
Kotz, R.5
Gobrecht, J.6
-
19
-
-
24144476257
-
Controlled co-evaporation of silanes for nanoimprint stamps
-
Schift H, Saxer S, Park S, Padeste C, Pieles U and Gobrecht J 2005 Controlled co-evaporation of silanes for nanoimprint stamps Nanotechnology 16 S171-5
-
(2005)
Nanotechnology
, vol.16
, Issue.5
-
-
Schift, H.1
Saxer, S.2
Park, S.3
Padeste, C.4
Pieles, U.5
Gobrecht, J.6
-
20
-
-
79957930952
-
-
Tanabe T, Jarzabek D, Matsue M, Kawata H, Rymuza Z and Hirai Y 2008 Impact of process conditions temperature [sic] on adhesion and friction forces in thermal NIL presented at Nanoimprint and Nanoprint Technology
-
(2008)
Presented at Nanoimprint and Nanoprint Technology
-
-
Tanabe, T.1
Jarzabek, D.2
Matsue, M.3
Kawata, H.4
Rymuza, Z.5
Hirai, Y.6
-
21
-
-
44149117259
-
Measurement of demolding forces in full wafer thermal nanoimprint
-
Trabadelo V, Schift H, Merino S, Bellini S and Gobrecht J 2008 Measurement of demolding forces in full wafer thermal nanoimprint Microelectron. Eng. 85 907-9
-
(2008)
Microelectron. Eng.
, vol.85
, Issue.5-6
, pp. 907-909
-
-
Trabadelo, V.1
Schift, H.2
Merino, S.3
Bellini, S.4
Gobrecht, J.5
-
22
-
-
42549084800
-
Quantitative characterizations of a nanopatterned bonded wafer: Force determination for nanoimprint lithography stamp removal
-
Landis S, Chaix N, Gourgon C and Leveder T 2008 Quantitative characterizations of a nanopatterned bonded wafer: force determination for nanoimprint lithography stamp removal Nanotechnology 19 125305
-
(2008)
Nanotechnology
, vol.19
, Issue.12
, pp. 125305
-
-
Landis, S.1
Chaix, N.2
Gourgon, C.3
Leveder, T.4
-
25
-
-
33847288208
-
Analysis of the demolding forces during hot embossing
-
DOI 10.1007/s00542-006-0225-9, HARMST, High Asprect Ratio Micro Structure Technology Workshop, Gyenogju, Korea, 10-13 June 2005 - part 2
-
Guo Y, Liu G, Zhu X and Tian Y 2007 Analysis of the demolding forces during hot embossing Microsyst. Technol. 13 411-5 (Pubitemid 46324413)
-
(2007)
Microsystem Technologies
, vol.13
, Issue.5-6
, pp. 411-415
-
-
Guo, Y.1
Liu, G.2
Zhu, X.3
Tian, Y.4
-
26
-
-
38149121497
-
PECVD amorphous silicon carbide membranes for cell culturing
-
Iliescu C, Chen B, Poenar D P and Lee Y Y 2008 PECVD amorphous silicon carbide membranes for cell culturing Sensors Actuators B 129 404-11
-
(2008)
Sensors Actuators
, vol.129
, Issue.1
, pp. 404-411
-
-
Iliescu, C.1
Chen, B.2
Poenar, D.P.3
Lee, Y.Y.4
-
27
-
-
0032753082
-
Characterization of a time multiplexed inductively coupled plasma etcher
-
Ayon A A, Braff R, Lin C C, Sawin H H and Schmidt M A 1999 Characterization of a time multiplexed inductively coupled plasma etcher J. Electrochem. Soc. 146 339-49
-
(1999)
J. Electrochem. Soc.
, vol.146
, Issue.1
, pp. 339-349
-
-
Ayon, A.A.1
Braff, R.2
Lin, C.C.3
Sawin, H.H.4
Schmidt, M.A.5
-
28
-
-
37849037295
-
Effects of patterning on the interface toughness of wafer-level Cu-Cu bonds
-
Tadepalli R, Turner K and Thompson C 2008 Effects of patterning on the interface toughness of wafer-level Cu-Cu bonds Acta Mater. 56 438-47
-
(2008)
Acta Mater.
, vol.56
, Issue.3
, pp. 438-447
-
-
Tadepalli, R.1
Turner, K.2
Thompson, C.3
|