Hot embossing in microfabrication. Part II: Rheological characterization and process analysis

Polymer Engineering and Science

Volumn 42, Issue 3, 2002, Pages 551-566

  Juang, Yi Je ^a   Lee James, L ^a   Koelling, Kurt W ^a  

^a The Ohio State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CORRELATION METHODS; FLOW PATTERNS; GLASS TRANSITION; POLYMETHYL METHACRYLATES; RHEOLOGY; SENSITIVITY ANALYSIS; STRAIN HARDENING; SUBSTRATES; VISCOSITY;

DYNAMIC SHEAR VISCOSITY; ISOTHERMAL EMBOSSING; TRANSIENT EXTENSIONAL VISCOSITY;

POLYCARBONATES;

EID: 0036502497     PISSN: 00323888     EISSN: None     Source Type: Journal    
DOI: 10.1002/pen.10971     Document Type: Article

References (16)