Analysis of the demolding forces during hot embossing

Microsystem Technologies

Volumn 13, Issue 5-6, 2007, Pages 411-415

  Guo, Yuhua ^a   Liu, Gang ^a   Zhu, Xuelin ^a   Tian, Yangchao ^a  

^a UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; COMPUTER SIMULATION; FINITE ELEMENT METHOD; FRICTION; INTERFACES (MATERIALS); MICROSTRUCTURE; ORGANIC POLYMERS; SHRINKAGE; STANDARDS; SURFACE STRUCTURE; THERMAL STRESS; THERMOPLASTICS; ULTRAVIOLET DEVICES;

FRICTION COEFFICIENTS; HOT EMBOSSING; POLYMER MICROFABRICATION; SURFACE ADHESION ENERGY;

PLASTICS MOLDING;

EID: 33847288208     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-006-0225-9     Document Type: Article

References (5)

1. Heckele M, Bacher W, Muller KD (1998) Hot embossing-the molding technique for plastic microstructures. Microsyst Technol 4:122-124
2. Pollock HM, Maugis D, Barquins M (1978) The force of adhesion between solid surfaces in contact. Appl Phys Lett 33:798
3. Tian Y, Zhang P, Liu G, Tian X (2005) The lifetime comparison of Ni and Ni-PTFE moulding inserts with high aspect-ratio structure. Microsyst Technol 11(4-5):261-264
4. Worgull M, Heckele M (2004) New aspects of simulation in hot embossing. Microsyst Technol 10:432-437
5. Zhang P, Liu G, Tian Y, Tian X (2005) The properties of demoulding of Ni and Ni-PTFE mouding insert. Sens Actuators A118:338-341