New aspects of simulation in hot embossing

Microsystem Technologies

Volumn 10, Issue 5, 2004, Pages 432-437

  Worgull, M ^a   Heckele, M ^a  

^a KARLSRUHE INSTITUTE OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMOTIVE INDUSTRY; COMPUTER AIDED SOFTWARE ENGINEERING; COMPUTER SIMULATION; DIFFUSION; HEALTH CARE; INJECTION MOLDING; MICROSTRUCTURE; VISCOELASTICITY;

HOT EMOBOSSING; MICROSYSTEMS TECHNOLOGY (MST); PROCESS PARAMETERS; VISCOELASTIC MATERIALS (VEM);

PLASTICS MOLDING;

EID: 4644305938     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-004-0418-z     Document Type: Conference Paper

References (5)

1. Heckele M; Bacher W; Müller KD (1998) Hot embossing - The molding technique for plastic microstructures. Microsys Technol 4(3): 122-124
2. Heckele M; Bacher W; Hanemann T; Ulrich H (1997) Hot embossing and injection molding for microoptical components. SPIE Conference, San Diego, California
3. Haberstroh E (2000) Simulation in plastics technology - state of the art and future needs Proceedings "Materials Week" Munich, pp. 1-13
4. MOLDFLOW® MPI 3.1 User reference
5. Wallrabe U et al. (2002) "Micromolded easy-assembly multi fiber connector: RibCon®"Microsys Technol 8