Effects of patterning on the interface toughness of wafer-level Cu-Cu bonds

Acta Materialia

Volumn 56, Issue 3, 2008, Pages 438-447

  Tadepalli, Rajappa ^a   Turner, Kevin T ^b   Thompson, Carl V ^a  

^a Massachusetts Institute of Technology   (United States)

^b University of Wisconsin Madison   (United States)

Author keywords

Bonding; Copper; Joining; Thin films; Toughness

Indexed keywords

COPPER; CRACK INITIATION; ENERGY DISSIPATION; FAILURE ANALYSIS; GROWTH (MATERIALS); THIN FILMS;

BOND TOUGHNESS; INTERFACE TOUGHNESS; PATTERN SIZES; THERMOCOMPRESSION BONDS;

CHEMICAL BONDS;

EID: 37849037295     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2007.10.016     Document Type: Article

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