Anti-adhesive layers on nickel stamps for nanoimprint lithography

Microelectronic Engineering

Volumn 73-74, Issue , 2004, Pages 196-201

  Park, Sunggook ^a   Schift, Helmut ^a   Padeste, Celestino ^a   Schnyder, Bernhard ^a   Kötz, R üdiger ^a   Gobrecht, Jens ^a  

^a PAUL SCHERRER INSTITUTE   (Switzerland)

Author keywords

Anti adhesive layer; Fluorinated silane; Nanoimprint lithography; Ni stamp

Indexed keywords

ADHESIVES; ANGLE MEASUREMENT; ATOMIC FORCE MICROSCOPY; COATINGS; CONTACT ANGLE; FRICTION; LITHOGRAPHY; NICKEL COMPOUNDS; OXIDATION; SILANES; X RAY PHOTOELECTRON SPECTROSCOPY;

ANTI-ADHESIVE LAYERS; FLUORINATED SILANES; NANOIMPRINT LITHOGRAPHY; NI STAMPS;

NANOTECHNOLOGY;

EID: 17344382000     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(04)00098-X     Document Type: Conference Paper

References (9)

1. Chou S.Y., Krauss P.R. Microelectron. Eng. 35:1997;237.
2. Jaszewski R.W., Schift H., Schnyder B., Schneuwly A., Gröning P. Appl. Surf. Sci. 143:1999;301.
3. Jaszewski R.W., Schift H., Gröning P., Margaritondo G. Microelectron. Eng. 35:1997;381.
4. Park S., Padeste C., Schift H., Gobrecht J. Microelectron. Eng. 67-68:2003;252.
5. Manual of contact angle measurement systems (G2, Krüss GmbH) p. 131.
6. Tsibouklis J., Nevell T.G. Adv. Mater. 15(7-8):2003;647.
7. Muscat J., Harrison N.M. Surf. Sci. 446:2000;119.
8. M. Beck, Doctoral Thesis in Lund University, 2003, p. 28.
9. Finder C., Beck M., Seekamp J., Pfeiffer K., Carlberg P., Maximov I., Reuther F., Sarwe E.-L., Zankovich S., Ahopelto J., Montelius L., Mayer C., Sotomayer Torres C.M. Microelectron. Eng. 67-68:2003;623.