-
1
-
-
67349116034
-
Fabrication of Au sidewall micropatterns using Si-reinforced PDMS molds
-
Liu X and Luo C 2009 Fabrication of Au sidewall micropatterns using Si-reinforced PDMS molds Sensors Actuators A 152 96-103
-
(2009)
Sensors Actuators
, vol.152
, Issue.1
, pp. 96-103
-
-
Liu, X.1
Luo, C.2
-
2
-
-
77950232896
-
Fabrication of super-hydrophobic channels
-
Liu X and Luo C 2010 Fabrication of super-hydrophobic channels J. Micromech. Microeng. 20 025029
-
(2010)
J. Micromech. Microeng.
, vol.20
, Issue.2
, pp. 025029
-
-
Liu, X.1
Luo, C.2
-
3
-
-
77957847299
-
Fabrication of micropatterns on the sidewalls of a thermal shape memory polystyrene block
-
Liu X, Chakraborty A and Luo C 2010 Fabrication of micropatterns on the sidewalls of a thermal shape memory polystyrene block J. Micromech. Microeng. 20 095025
-
(2010)
J. Micromech. Microeng.
, vol.20
, Issue.9
, pp. 095025
-
-
Liu, X.1
Chakraborty, A.2
Luo, C.3
-
4
-
-
78649752715
-
Fabrication of Au micropatterns on vertical Si sidewalls using PDMS membranes as shadow masks
-
Wang H and Luo C 2010 Fabrication of Au micropatterns on vertical Si sidewalls using PDMS membranes as shadow masks J. Micromech. Microeng. 20 127001
-
(2010)
J. Micromech. Microeng.
, vol.20
, Issue.12
, pp. 127001
-
-
Wang, H.1
Luo, C.2
-
6
-
-
14244254198
-
Fabrication of high aspect ratio metal shadow mask for OTFTs
-
Yi S M, Jin S H, Lee J D and Chu C N 2005 Fabrication of high aspect ratio metal shadow mask for OTFTs J. Micromech. Microeng. 15 263-9
-
(2005)
J. Micromech. Microeng.
, vol.15
, Issue.2
, pp. 263-269
-
-
Yi, S.M.1
Jin, S.H.2
Lee, J.D.3
Chu, C.N.4
-
7
-
-
38349110906
-
Fabrication of a stainless steel shadow mask using batch mode micro-EDM
-
Yi S M, Park M S, Lee Y S and Chu C N 2008 Fabrication of a stainless steel shadow mask using batch mode micro-EDM Microsyst. Technol. 14 411-7
-
(2008)
Microsyst. Technol.
, vol.14
, Issue.3
, pp. 411-417
-
-
Yi, S.M.1
Park, M.S.2
Lee, Y.S.3
Chu, C.N.4
-
8
-
-
10944242323
-
Microstenciling: A generic technology for microscale patterning of vapor deposited materials
-
DOI 10.1109/JMEMS.2004.838368
-
Graff M, Mohanty S K, Moss E and Frazier A B 2004 Microstenciling: a generic technology for microscale patterning of vapor deposited materials J. Microelectromech. Syst. 13 956-62 (Pubitemid 40009497)
-
(2004)
Journal of Microelectromechanical Systems
, vol.13
, Issue.6
, pp. 956-962
-
-
Graff, M.1
Mohanty, S.K.2
Moss, E.3
Frazier, A.B.4
-
10
-
-
0036544431
-
The application of nanosecond-pulsed laser welding technology in MEMS packaging with a shadow mask
-
DOI 10.1016/S0924-4247(01)00849-4, PII S0924424701008494
-
Luo C and Lin L 2002 The application of nanosecond-pulsed laser welding technology in MEMS packaging with a shadow mask Sensors Actuators A 97-98 398-404 (Pubitemid 34758746)
-
(2002)
Sensors and Actuators, A: Physical
, vol.97-98
, pp. 398-404
-
-
Luo, C.1
Lin, L.2
-
11
-
-
0142123330
-
All-photoplastic microstencil with self-alignment for multiple layer shadow-mask patterning
-
Kim G, Kim B and Brugger J 2003 All-photoplastic microstencil with self-alignment for multiple layer shadow-mask patterning Sensors Actuators 107 132-6
-
(2003)
Sensors Actuators
, vol.107
, Issue.2
, pp. 132-136
-
-
Kim, G.1
Kim, B.2
Brugger, J.3
-
12
-
-
0000034944
-
High-resolution shadow-mask patterning in deep holes and its application to an electrical wafer feed-through
-
Burger G J, Smulders E J T, Berenschot J W, Lammerink T S J, Fluitman J H J and Imai S 1996 High-resolution shadow-mask patterning in deep holes and its application to an electrical wafer feed-through Sensors Actuators A 54 669-73 (Pubitemid 126357032)
-
(1996)
Sensors and Actuators, A: Physical
, vol.54
, Issue.1-3
, pp. 669-673
-
-
Burger, G.J.1
Smulders, E.J.T.2
Berenschot, J.W.3
Lammerink, T.S.J.4
Fluitman, J.H.J.5
Imai, S.6
-
14
-
-
33845353722
-
A three-dimensional microfabrication technology on highly structured surfaces
-
Su W-S, Tsai M-S and Fang W 2007 A three-dimensional microfabrication technology on highly structured surfaces Electrochem. Solid-State Lett. 10 H16-9
-
(2007)
Electrochem. Solid-State Lett.
, vol.10
, Issue.1
-
-
Su, W.-S.1
Tsai, M.-S.2
Fang, W.3
-
15
-
-
0343932624
-
Self-aligned 3D shadow mask technique for patterning deeply recessed surfaces of micro-electro-mechanical systems devices
-
DOI 10.1016/S0924-4247(98)00286-6
-
Brugger J, Andreoli C, Despont M, Drechsler U, Rothuizen H and Vettiger P 1999 Self-aligned 3D shadow mask technique for patterning deeply recessed surfaces of micro-electro-mechanical systems devices Sensors Actuators A 76 329-34 (Pubitemid 30543223)
-
(1999)
Sensors and Actuators, A: Physical
, vol.76
, Issue.1-3
, pp. 329-334
-
-
Brugger, J.1
Andreoli, C.2
Despont, M.3
Drechsler, U.4
Rothuizen, H.5
Vettiger, P.6
-
16
-
-
0029390658
-
Photolithography on micromachined 3D surfaces using electrodeposited photoresists
-
Kersten P, Boustra S and Petersen J W 1995 Photolithography on micromachined 3D surfaces using electrodeposited photoresists Sensors Actuators A 51 51-4
-
(1995)
Sensors Actuators
, vol.51
, Issue.1
, pp. 51-54
-
-
Kersten, P.1
Boustra, S.2
Petersen, J.W.3
-
17
-
-
70949102296
-
Controlled-width track in through silicon via using 3D holographic photolithography with modified electrodepositable photoresist
-
Toriz-Garcia J J, Williams G L, McWilliam R, Curry R, Seed N L, Purvis A and Ivey P A 2010 Controlled-width track in through silicon via using 3D holographic photolithography with modified electrodepositable photoresist J. Micromech. Microeng. 20 015012
-
(2010)
J. Micromech. Microeng.
, vol.20
, Issue.1
, pp. 015012
-
-
Toriz-Garcia, J.J.1
Williams, G.L.2
McWilliam, R.3
Curry, R.4
Seed, N.L.5
Purvis, A.6
Ivey, P.A.7
-
18
-
-
33744539500
-
Spray coating of photoresist for 3D microstructures with different geometries
-
Yu L, Lee Y Y, Tay F E H and Iliescu C 2006 Spray coating of photoresist for 3D microstructures with different geometries J. Phys.: Conf. Ser. 34 937
-
(2006)
J. Phys.: Conf. Ser.
, vol.34
, pp. 937
-
-
Yu, L.1
Lee, Y.Y.2
Tay, F.E.H.3
Iliescu, C.4
-
19
-
-
0027578578
-
The influence of sloped absorber sidewalls in deep x-ray lithography
-
Schulz J, El-Kholi A, Gottert J, Kadel K and Mohr J 1993 The influence of sloped absorber sidewalls in deep x-ray lithography Microelectron. Eng. 21 117-21
-
(1993)
Microelectron. Eng.
, vol.21
, Issue.1-4
, pp. 117-121
-
-
Schulz, J.1
El-Kholi, A.2
Gottert, J.3
Kadel, K.4
Mohr, J.5
-
20
-
-
0442280362
-
3D microfabrication with inclined/rotated UV lithography
-
Han M, Lee W, Lee S-K and Lee S S 2004 3D microfabrication with inclined/rotated UV lithography Sensors Actuators A 111 14-20
-
(2004)
Sensors Actuators
, vol.111
, Issue.1
, pp. 14-20
-
-
Han, M.1
Lee, W.2
Lee, S.-K.3
Lee, S.S.4
-
21
-
-
33645138130
-
Improved inclined multi-lithography using water as exposure medium and its 3D mixing microchannel application
-
Sato H, Yagyu D, Ito S and Shoji S 2006 Improved inclined multi-lithography using water as exposure medium and its 3D mixing microchannel application Sensors Actuators A 128 183-90
-
(2006)
Sensors Actuators
, vol.128
, Issue.1
, pp. 183-190
-
-
Sato, H.1
Yagyu, D.2
Ito, S.3
Shoji, S.4
-
22
-
-
58149354163
-
Modeling, simulation and experimental verification of inclined UV lithography for SU-8 negative thick photoresists
-
Zhen Z et al 2008 Modeling, simulation and experimental verification of inclined UV lithography for SU-8 negative thick photoresists J. Micromech. Microeng. 18 125017
-
(2008)
J. Micromech. Microeng.
, vol.18
, Issue.12
, pp. 125017
-
-
Zhen, Z.1
-
23
-
-
68249161270
-
Pattern transfer on a vertical cavity sidewall using SU8
-
Verhaar T M et al 2009 Pattern transfer on a vertical cavity sidewall using SU8 J. Micromech. Microeng. 19 074018
-
(2009)
J. Micromech. Microeng.
, vol.19
, Issue.7
, pp. 074018
-
-
Verhaar, T.M.1
-
24
-
-
24644456099
-
Development of an advanced three-dimensional MCM-D substrate level patterning technique
-
Nellissen T, Botermans M, Burghoorn M, Delft J V, Grunsven E V, Scheer J and Samber M D 2004 Development of an advanced three-dimensional MCM-D substrate level patterning technique European Microelectronics and Packaging Symp. pp 459-64
-
(2004)
European Microelectronics and Packaging Symp.
, pp. 459-464
-
-
Nellissen, T.1
Botermans, M.2
Burghoorn, M.3
Delft, J.V.4
Grunsven, E.V.5
Scheer, J.6
Samber, M.D.7
|