Self-aligned 3D shadow mask technique for patterning deeply recessed surfaces of micro-electro-mechanical systems devices

Sensors and Actuators, A: Physical

Volumn 76, Issue 1-3, 1999, Pages 329-334

  Brugger, J ^a   Andreoli, C ^a   Despont, M ^a   Drechsler, U ^a   Rothuizen, H ^a   Vettiger, P ^a  

^a IBM RESEARCH ZURICH   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

ETCHING; MASKS; MICROMACHINING; PATTERN RECOGNITION; SILICON; SURFACE TOPOGRAPHY; THREE DIMENSIONAL;

BACKSIDE PROCESSING; DEEP TRENCH ETCHING; SHADOW MASK TECHNIQUE;

MICROELECTROMECHANICAL DEVICES;

EID: 0343932624     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(98)00286-6     Document Type: Article

References (6)

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2. St. Linder, PhD Thesis, No. 11347, Swiss Federal Institute of Technology (ETH), Zurich, Switzerland, 1996.
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5. US patent pending.
6. M. Lutwyche, C. Andreoli, G. Binnig, J. Brugger, U. Drechsler, W. Häberle, H. Rohrer, H. Rothuizen, P. Vettiger, Microfabrication and parallel operation of 5×5 2D AFM cantilever arrays for data storage and imaging, Sensors and Actuators A, to be published.