-
3
-
-
0032138470
-
Surface micromachining for microelctromechanical systems
-
Bustillo J M, Howe R T and Muller R S 1998 Surface micromachining for microelctromechanical systems Proc. IEEE 86 1552-74
-
(1998)
Proc. IEEE
, vol.86
, pp. 1552-1574
-
-
Bustillo, J.M.1
Howe, R.T.2
Muller, R.S.3
-
5
-
-
0000064757
-
Electric-field assisted assembly and alignment of metallic nanowires
-
Peter A S, Christopher D N, Thomas N J, Theresa S M, Benjamin R M, Jeremiah M and Thomas E M 2000 Electric-field assisted assembly and alignment of metallic nanowires Appl. Phys. Lett. 77 1399-401
-
(2000)
Appl. Phys. Lett.
, vol.77
, pp. 1399-1401
-
-
Peter, A.S.1
Christopher, D.N.2
Thomas, N.J.3
Theresa, S.M.4
Benjamin, R.M.5
Jeremiah, M.6
Thomas, E.M.7
-
7
-
-
2342440729
-
Toward large-scale integration of carbon nanotubes
-
Chung J, Lee K-H, Lee J and Ruoff R S 2004 Toward large-scale integration of carbon nanotubes Langmuir 20 3011-7
-
(2004)
Langmuir
, vol.20
, pp. 3011-3017
-
-
Chung, J.1
Lee, K.-H.2
Lee, J.3
Ruoff, R.S.4
-
8
-
-
18144402047
-
Electric-field assisted growth and self-assembly of intrinsic silicon nanowires
-
Englander O, Christensen D, Kim J, Lin L and Morris S J S 2005 Electric-field assisted growth and self-assembly of intrinsic silicon nanowires Nano Lett. 5 705-8
-
(2005)
Nano. Lett.
, vol.5
, pp. 705-708
-
-
Englander, O.1
Christensen, D.2
Kim, J.3
Lin, L.4
Morris, S.J.S.5
-
9
-
-
2342578784
-
Fabrication of nanoelectrodes based on controlled placement of carbon nanotubes using alternating-current electric field
-
Chen Z, Hu W, Guo J and Saito K 2004 Fabrication of nanoelectrodes based on controlled placement of carbon nanotubes using alternating-current electric field J. Vac. Sci. Technol. B 22 776-80
-
(2004)
J. Vac. Sci. Technol. B.
, vol.22
, pp. 776-780
-
-
Chen, Z.1
Hu, W.2
Guo, J.3
Saito, K.4
-
10
-
-
0034684172
-
Microchannel networks for nanowire patterning
-
Messer B, Song J H and Yang P 2000 Microchannel networks for nanowire patterning J. Am. Chem. Soc. 122 10232-3
-
(2000)
J. Am. Chem. Soc.
, vol.122
, pp. 10232-10233
-
-
Messer, B.1
Song, J.H.2
Yang, P.3
-
11
-
-
0034824859
-
Directed assembly of one-dimensional nanostructures into functional networks
-
DOI 10.1126/science.291.5504.630
-
Huang Y, Duan X, Wei Q and Lieber C M 2001 Directed assembly of one-dimensional nanostructures into functional networks Science 291 630-3 (Pubitemid 32150417)
-
(2001)
Science
, vol.291
, Issue.5504
, pp. 630-633
-
-
Huang, Y.1
Duan, X.2
Wei, Q.3
Lieber, C.M.4
-
12
-
-
0033614026
-
'Dip-Pen' nanolithography
-
Piner R D, Zhu J, Xu F, Hong S and Mirkin C A 1999 'Dip-Pen' nanolithography Science 283 661-3
-
(1999)
Science
, vol.283
, pp. 661-663
-
-
Piner, R.D.1
Zhu, J.2
Xu, F.3
Hong, S.4
Mirkin, C.A.5
-
13
-
-
0142216206
-
Scanning probe contact printing
-
Wang X, Ryu K S, Bullen D A, Zou J, Zhang H, Mirkin C A and Liu C 2003 Scanning probe contact printing Langmuir 19 8951-5
-
(2003)
Langmuir
, vol.19
, pp. 8951-8955
-
-
Wang, X.1
Ryu, K.S.2
Bullen, D.A.3
Zou, J.4
Zhang, H.5
Mirkin, C.A.6
Liu, C.7
-
15
-
-
0346704264
-
Unconventional methods for fabricating and patterning nanostructures
-
Xia Y, Rogers J A, Paul K E and Whitesides G M 1999 Unconventional methods for fabricating and patterning nanostructures Chem. Rev. 99 1823-48
-
(1999)
Chem. Rev.
, vol.99
, pp. 1823-1848
-
-
Xia, Y.1
Rogers, J.A.2
Paul, K.E.3
Whitesides, G.M.4
-
16
-
-
0030570065
-
Imprint lithography with 25-nanometer resolution
-
Chou S Y, Krauss P R and Renstrom P J 1996 Imprint lithography with 25-nanometer resolution Science 272 85-7
-
(1996)
Science
, vol.272
, pp. 85-87
-
-
Chou, S.Y.1
Krauss, P.R.2
Renstrom, P.J.3
-
18
-
-
68249161270
-
Pattern transfer on a vertical cavity sidewall using SU8
-
Verhaar T M, Wei J and Sarro P M 2009 Pattern transfer on a vertical cavity sidewall using SU8 J. Micromech. Microeng. 19 074018
-
(2009)
J. Micromech. Microeng
, vol.19
, pp. 074018
-
-
Verhaar, T.M.1
Wei, J.2
Sarro, P.M.3
-
19
-
-
24644456099
-
Development of an advanced three-dimensional MCM-D substrate level patterning technique
-
Nellissen T, Botermans M, Burghoorn M, Delft J V, Grunsven E V, Scheer J and Samber M D 2004 Development of an advanced three-dimensional MCM-D substrate level patterning technique European Microelectronics and Packaging Symp. pp 459-64
-
(2004)
European Microelectronics and Packaging Symp.
, pp. 459-464
-
-
Nellissen, T.1
Botermans, M.2
Burghoorn, M.3
Delft, J.V.4
Grunsven, E.V.5
Scheer, J.6
Samber, M.D.7
-
20
-
-
67349116034
-
Fabrication of Au sidewall micropatterns using Si-reinforced PDMS molds
-
Liu X and Luo C 2009 Fabrication of Au sidewall micropatterns using Si-reinforced PDMS molds Sensors Actuators A 152 96-103
-
(2009)
Sensors Actuators A
, vol.152
, pp. 96-103
-
-
Liu, X.1
Luo, C.2
-
21
-
-
77950232896
-
Fabrication of super-hydrophobic channels
-
Liu X and Luo C 2010 Fabrication of super-hydrophobic channels J. Micromech. Microeng. 20 025029
-
(2010)
J. Micromech. Microeng
, vol.20
, pp. 025029
-
-
Liu, X.1
Luo, C.2
-
22
-
-
77957847299
-
Fabrication of micropatterns on the sidewalls of a thermal shape-memory polystyrene block
-
Liu X, Chakraborty A and Luo C 2010 Fabrication of micropatterns on the sidewalls of a thermal shape-memory polystyrene block J. Micromech. Microeng. 20 095025
-
(2010)
J. Micromech. Microeng
, vol.20
, pp. 095025
-
-
Liu, X.1
Chakraborty, A.2
Luo, C.3
-
23
-
-
0141658407
-
Ultra-deep anisotropic etching of (1 1 0) silicon
-
Holke A and Henderson H T 1999 Ultra-deep anisotropic etching of (1 1 0) silicon J. Micromech. Microeng. 9 51-7
-
(1999)
J. Micromech. Microeng
, vol.9
, pp. 51-57
-
-
Holke, A.1
Henderson, H.T.2
-
24
-
-
78649756175
-
-
Gmbh US Patents 4855017 and 4784720
-
R Bosch Gmbh US Patents 4855017 and 4784720
-
-
-
Bosch, R.1
-
25
-
-
3042811848
-
Releasing SU-8 structures using polystyrene as a sacrificial material
-
Luo C, Govindaraju A, Garra J, Schneider T, White R, Currie J and Paranjape M 2004 Releasing SU-8 structures using polystyrene as a sacrificial material Sensors Actuators A 114 123-8
-
(2004)
Sensors Actuators A
, vol.114
, pp. 123-128
-
-
Luo, C.1
Govindaraju, A.2
Garra, J.3
Schneider, T.4
White, R.5
Currie, J.6
Paranjape, M.7
-
26
-
-
33746843206
-
Fabrication and application of silicon-reinforced PDMS masters
-
Luo C, Meng F and Francis A 2006 Fabrication and application of silicon-reinforced PDMS masters Microelectron. J. 37 1036-46
-
(2006)
Microelectron. J.
, vol.37
, pp. 1036-1046
-
-
Luo, C.1
Meng, F.2
Francis, A.3
-
27
-
-
33846297733
-
Bond-detach lithography: A method for micro/nanolithography by precision PDMS patterning
-
Thangawng A L, Swartz M A, Glucksberg M R and Ruoff R S 2005 Bond-detach lithography: a method for micro/nanolithography by precision PDMS patterning Small 3 132-8
-
(2005)
Small
, vol.3
, pp. 132-138
-
-
Thangawng, A.L.1
Swartz, M.A.2
Glucksberg, M.R.3
Ruoff, R.S.4
-
28
-
-
52649118743
-
Perforated membrane method for fabricating three-dimensional polydimethylsiloxane microfluidic devices
-
Luo Y and Zare R 2008 Perforated membrane method for fabricating three-dimensional polydimethylsiloxane microfluidic devices Lab Chip 8 1688-94
-
(2008)
Lab. Chip
, vol.8
, pp. 1688-1694
-
-
Luo, Y.1
Zare, R.2
-
29
-
-
67849083164
-
Fabrication of a poly (dimethylsiloxane) membrane with well-defined through-holes for three-dimensional microfluidic networks
-
Kang J H, Um E and Park J-K 2009 Fabrication of a poly (dimethylsiloxane) membrane with well-defined through-holes for three-dimensional microfluidic networks J. Micromech. Microeng. 19 045027
-
(2009)
J. Micromech. Microeng
, vol.19
, pp. 045027
-
-
Kang, J.H.1
Um, E.2
Park, J.-K.3
-
30
-
-
2942657677
-
Thermal effects in plasma treatment of patterned PDMS for bonding stacked channels
-
Zou J and Wong P Y 2004 Thermal effects in plasma treatment of patterned PDMS for bonding stacked channels Mat. Res. Soc. Symp. Proc. 782 A5.5
-
(2004)
Mat. Res. Soc. Symp. Proc.
, vol.782
-
-
Zou, J.1
Wong, P.Y.2
-
31
-
-
58149347087
-
Thick single-layer positive photoresist mold and poly (dimethylsiloxane) (PDMS) dry etching for the fabrication of a glass PDMS glass microfluidic device
-
Oh S R 2008 Thick single-layer positive photoresist mold and poly (dimethylsiloxane) (PDMS) dry etching for the fabrication of a glass PDMS glass microfluidic device J. Micromech. Microeng. 18 115025
-
(2008)
J. Micromech. Microeng
, vol.18
, pp. 115025
-
-
Oh, S.R.1
-
32
-
-
70350635564
-
Dry etching of polydimethylsiloxane using microwave plasma
-
Hwang S J, Oh D J, Jung P G, Lee S M, Go J S, Kim J-H, Hwang K-Y and Ko J S 2009 Dry etching of polydimethylsiloxane using microwave plasma J. Micromech. Microeng. 19 095010
-
(2009)
J. Micromech. Microeng
, vol.19
, pp. 095010
-
-
Hwang, S.J.1
Oh, D.J.2
Jung, P.G.3
Lee, S.M.4
Go, J.S.5
Kim, J.-H.6
Hwang, K.-Y.7
Ko, J.S.8
-
33
-
-
0036575748
-
Controlled growth of ZnO nanowires and their optical properties
-
Yang P, Yan H, Mao S, Russo R, Johnson J, Saykally R, Morris N, Pham J, He R and Choi H J 2002 Controlled growth of ZnO nanowires and their optical properties Adv. Funct. Mater. 12 323-31
-
(2002)
Adv. Funct. Mater.
, vol.12
, pp. 323-331
-
-
Yang, P.1
Yan, H.2
Mao, S.3
Russo, R.4
Johnson, J.5
Saykally, R.6
Morris, N.7
Pham, J.8
He, R.9
Choi, H.J.10
|