The application of nanosecond-pulsed laser welding technology in MEMS packaging with a shadow mask

Sensors and Actuators, A: Physical

Volumn 97-98, Issue , 2002, Pages 398-404

  Luo, Cheng ^a   Lin, Liwei ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Bonding; Heat transfer; Laser; Mask; Packaging

Indexed keywords

COMPUTER SIMULATION; ELECTRONICS PACKAGING; HEAT TRANSFER; LASER BEAM WELDING; MASKS; PULSED LASER APPLICATIONS; SOLID STATE LASERS;

NANOSECOND LASER WELDING; SHADOW MASK;

MICROELECTROMECHANICAL DEVICES;

EID: 0036544431     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(01)00849-4     Document Type: Conference Paper

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