Critical tensile and compressive strains for cracking of Al 2O3 films grown by atomic layer deposition

Journal of Applied Physics

Volumn 109, Issue 8, 2011, Pages

  Jen, Shih Hui ^a   Bertrand, Jacob A ^a   George, Steven M ^a,b  

^a UNIVERSITY OF COLORADO   (United States)

^b UCB 450   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPRESSIVE STRAIN; CRACK DENSITY; CRITICAL STRAINS; FIELD EMISSION SCANNING ELECTRON MICROSCOPY; FILM CRACKING; FLUORESCENT TAGGING; FLUORINATED ETHYLENE PROPYLENE; GAS DIFFUSION; POLYETHYLENE NAPHTHALATE; TEFLON FEP;

ALUMINUM; ATOMIC LAYER DEPOSITION; CRACKS; DIFFUSION BARRIERS; DIFFUSION IN GASES; ENAMELS; ETHYLENE; FILM GROWTH; FILM THICKNESS; FRACTURE; FRACTURE MECHANICS; FRACTURE TOUGHNESS; POLYMERS; POLYTETRAFLUOROETHYLENES; PROPYLENE; SCANNING ELECTRON MICROSCOPY; SUBSTRATES; TENSILE STRAIN;

GAS PERMEABLE MEMBRANES;

EID: 79955725987     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3567912     Document Type: Article

References (61)

1. A. C. Dillon, A. W. Ott, J. D. Way, and S. M. George, Surf. Sci. 322, 230 (1995). 10.1016/0039-6028(95)90033-0
2. S. M. George, Chem. Rev. 110, 111 (2010). 10.1021/cr900056b
3. S. M. George, A. W. Ott, and J. W. Klaus, J. Phys. Chem. 100, 13121 (1996). 10.1021/jp9536763
4. A. W. Ott, J. W. Klaus, J. M. Johnson, and S. M. George, Thin Solid Films 292, 135 (1997). 10.1016/S0040-6090(96)08934-1
5. M. K. Tripp, C. Stampfer, D. C. Miller, T. Helbling, C. F. Hermann, C. Hierold, K. Gall, S. M. George, and V. M. Bright, Sens. Actuators, A 130, 419 (2006).
6. K. Tapily, J. E. Jakes, D. S. Stone, P. Shrestha, D. Gu, H. Baumgart, and A. A. Elmustafa, J. Electrochem. Soc. 155, H545 (2008). 10.1149/1.2919106 (Pubitemid 351747828)
7. D. C. Miller, R. R. Foster, S. H. Jen, J. A. Bertrand, S. J. Cunningham, A. S. Morris, Y. C. Lee, S. M. George, and M. L. Dunn, Sens. Actuators, A 164, 58 (2010). 10.1016/j.sna.2010.09.018
8. D. C. Miller, R. R. Foster, Y. D. Zhang, S. H. Jen, J. A. Bertrand, Z. X. Lu, D. Seghete, J. L. O'Patchen, R. G. Yang, Y. C. Lee, S. M. George, and M. L. Dunn, J. Appl. Phys. 105, 093527 (2009). 10.1063/1.3124642
9. B. A. Latella, G. Triani, and P. J. Evans, Scr. Mater. 56, 493 (2007). 10.1016/j.scriptamat.2006.11.021 (Pubitemid 46073812)
10. P. F. Carcia, R. S. McLean, M. D. Groner, A. A. Dameron, and S. M. George, J. Appl. Phys. 106, 023533 (2009). 10.1063/1.3159639
11. P. F. Carcia, R. S. McLean, M. H. Reilly, M. D. Groner, and S. M. George, Appl. Phys. Lett. 89, 031915 (2006). 10.1063/1.2221912 (Pubitemid 44107043)
12. R. Cooper, H. P. Upadhyaya, T. K. Minton, M. R. Berman, X. H. Du, and S. M. George, Thin Solid Films 516, 4036 (2008). 10.1016/j.tsf.2007.07.150
13. M. D. Groner, S. M. George, R. S. McLean, and P. F. Carcia, Appl. Phys. Lett. 88, 051907 (2006). 10.1063/1.2168489 (Pubitemid 43190860)
14. E. Langereis, M. Creatore, S. B. S. Heil, M. C. M. Van de Sanden, and W. M. M. Kessels, Appl. Phys. Lett. 89, 081915 (2006). 10.1063/1.2338776 (Pubitemid 44286139)
15. A. P. Ghosh, L. J. Gerenser, C. M. Jarman, and J. E. Fornalik, Appl. Phys. Lett. 86, 223503 (2005). 10.1063/1.1929867 (Pubitemid 40861631)
16. N. Kim, W. J. Potscavage, B. Domercq, B. Kippelen, and S. Graham, Appl. Phys. Lett. 94, 163308 (2009). 10.1063/1.3115144
17. J. Meyer, D. Schneidenbach, T. Winkler, S. Hamwi, T. Weimann, P. Hinze, S. Ammermann, H. H. Johannes, T. Riedl, and W. Kowalsky, Appl. Phys. Lett. 94, 233305 (2009). 10.1063/1.3153123
18. S. H. K. Park, J. Oh, C. S. Hwang, J. I. Lee, Y. S. Yang, and H. Y. Chu, Electrochem. Solid State Lett. 8, H21 (2005). 10.1149/1.1850396 (Pubitemid 40214051)
19. C. Y. Chang, C. T. Chou, Y. J. Lee, M. J. Chen, and F. Y. Tsai, Org. Electron. 10, 1300 (2009). 10.1016/j.orgel.2009.07.008
20. W. J. Potscavage, S. Yoo, B. Domercq, and B. Kippelen, Appl. Phys. Lett. 90, 253511 (2007). 10.1063/1.2751108
21. S. Ferrari, F. Perissinotti, E. Peron, L. Fumagalli, D. Natali, and M. Sampietro, Org. Electron. 8, 407 (2007). 10.1016/j.orgel.2007.02.004 (Pubitemid 46755048)
22. R. K. Kirby, J. Res. Natl. Bur. Stand. 57, 91 (1956).
23. Y. Leterrier, L. Medico, F. Demarco, J. A. E. Manson, U. Betz, M. F. Escola, M. K. Olsson, and F. Atamny, Thin Solid Films 460, 156 (2004). 10.1016/j.tsf.2004.01.052
24. P. C. P. Bouten, P. J. Slikkerveer, and Y. Leterrier, Mechanics of ITO on Plastic Substrates for Flexible Displays, in Flexible Flat Panel Displays, edited by, G. P. Crawford, (Wiley, West Sussex, UK, 2005)
25. Y. Leterrier, Prog. Mater. Sci. 48, 1 (2003). 10.1016/S0079-6425(02) 00002-6
26. Y. Leterrier, J. Andersons, Y. Pitton, and J. A. E. Manson, J. Polym. Sci., Part B: Polym. Phys. 35, 1463 (1997). 10.1002/(SICI)1099-0488(19970715)35: 91.0.CO;2-N
27. Y. Leterrier, L. Boogh, J. Andersons, and J. A. E. Manson, J. Polym. Sci., Part B: Polym. Phys. 35, 1449 (1997). 10.1002/(SICI)1099-0488(19970715)35: 91.0.CO;2-N
28. A. A. Abdallah, D. Kozodaev, P. C. P. Bouten, J. M. J. den Toonder, U. S. Schubert, and G. de With, Thin Solid Films 503, 167 (2006). 10.1016/j.tsf.2005.11.106 (Pubitemid 43343593)
29. C. Chaiwong, D. R. McKenzie, and M. M. M. Bilek, Surf. Coat. Technol. 201, 5596 (2007). 10.1016/j.surfcoat.2006.07.200 (Pubitemid 46158618)
30. Z. Chen, B. Cotterell, and W. Wang, Eng. Fract. Mech. 69, 597 (2002). 10.1016/S0013-7944(01)00104-7 (Pubitemid 34271604)
31. C. Coupeau, Thin Solid Films 406, 190 (2002). 10.1016/S0040-6090(01) 01772-2 (Pubitemid 34440503)
32. J. W. Elam, D. Routkevitch, P. P. Mardilovich, and S. M. George, Chem. Mater. 15, 3507 (2003). 10.1021/cm0303080
33. J. C. Grosskre, J. Electrochem. Soc. 116, 1232 (1969). 10.1149/1.2412286
34. B. A. Latella, G. Triani, Z. Zhang, K. T. Short, J. R. Bartlett, and M. Ignat, Thin Solid Films 515, 3138 (2007). 10.1016/j.tsf.2006.08.022 (Pubitemid 46038446)
35. M. D. Groner, F. H. Fabreguette, J. W. Elam, and S. M. George, Chem. Mater. 16, 639 (2004). 10.1021/cm0304546
36. C. A. Wilson, R. K. Grubbs, and S. M. George, Chem. Mater. 17, 5625 (2005). 10.1021/cm050704d (Pubitemid 41692215)
37. W. A. MacDonald, M. K. Looney, D. MacKerron, R. Eveson, R. Adam, K. Hashimoto, and K. Rakos, J. Soc. Inf. Disp. 15, 1075 (2007). 10.1889/1.2825093
38. M. DeBergalis, J. Fluorine Chem. 125, 1255 (2004). 10.1016/j.jfluchem. 2004.05.013
39. A. A. Dameron, S. D. Davidson, B. B. Burton, P. F. Carcia, R. S. McLean, and S. M. George, J. Phys. Chem. C 112, 4573 (2008). 10.1021/jp076866+
40. J. W. Elam, M. D. Groner, and S. M. George, Rev. Sci. Instrum. 73, 2981 (2002). 10.1063/1.1490410 (Pubitemid 34946326)
41. ASTM International, Standard test method for tensile properties of thin plastic sheeting., ASTM Report No. D882-02, 2002;
42. ASTM International, Standard test method for tensile properties of plastics., ASTM Report No. D638-03, 2003.
43. Y. D. Zhang, Y. Z. Zhang, D. C. Miller, J. A. Bertrand, S. H. Jen, R. G. Yang, M. L. Dunn, S. M. George, and Y. C. Lee, Thin Solid Films 517, 6794 (2009). 10.1016/j.tsf.2009.05.037
44. G. Simmons and H. Wang, Single Crystal Elastic Constants and Calculated Aggregate Properties: A Handbook, 2nd ed. (MIT, Cambridge, MA, 1971).
45. G. J. Dvorak and N. Laws, J. Compos. Mater. 21, 309 (1987). 10.1177/002199838702100402
46. M. S. Hu and A. G. Evans, Acta Mater. 37, 917 (1989). 10.1016/0001-6160(89)90018-7
47. N. E. Jansson, Y. Leterrier, and J. A. E. Manson, Eng. Fract. Mech. 73, 2614 (2006). 10.1016/j.engfracmech.2006.04.013 (Pubitemid 44275893)
48. S. R. Kim and J. A. Nairn, Eng. Fract. Mech. 65, 573 (2000). 10.1016/S0013-7944(99)00141-1 (Pubitemid 30255170)
49. N. Laws and G. J. Dvorak, J. Compos. Mater. 22, 900 (1988). 10.1177/002199838802201001
50. 1/2.
51. G. Krautheim, T. Hecht, S. Jakschik, U. Schroder, and W. Zahn, Appl. Surf. Sci. 252, 200 (2005). 10.1016/j.apsusc.2005.01.118 (Pubitemid 41276975)
52. R. L. Puurunen, J. Saarilahti, and H. Kattelus, ECS Trans. 11, 3 (2007). 10.1149/1.2779063
53. J. S. Lewis and M. S. Weaver, IEEE J. Sel. Top. Quantum Electron. 10, 45 (2004). 10.1109/JSTQE.2004.824072
54. Z. Suo, E. Y. Ma, H. Gleskova, and S. Wagner, Appl. Phys. Lett. 74, 1177 (1999). 10.1063/1.123478 (Pubitemid 129710395)
55. M. Yanaka, Y. Tsukahara, N. Nakaso, and N. Takeda, J. Mater. Sci. 33, 2111 (1998). 10.1023/A:1004371203514
56. J. Thurn and R. F. Cook, J. Mater. Sci. 39, 4809 (2004). 10.1023/B:JMSC.0000035319.81486.62
57. D. Casellas, M. M. Nagl, L. Llanes, and A. Anglada, J. Mater. Process. Technol. 143, 148 (2003). 10.1016/S0924-0136(03)00396-0
58. 3, NIST Ceramics WebBook, http://www.ceramics.nist.gov.
59. B. Cotterell and Z. Chen, Int. J. Fract. 104, 169 (2000). 10.1023/A:1007628800620
60. M. D. Thouless, J. Am. Ceram. Soc. 76, 2936 (1993). 10.1111/j.1151-2916. 1993.tb04044.x
61. H. H. Yu and J. W. Hutchinson, Int. J. Fract. 113, 39 (2002). 10.1023/A:1013790232359 (Pubitemid 34156128)