Buckling and cracking of thin films on compliant substrates under compression

International Journal of Fracture

Volumn 104, Issue 2, 2000, Pages 169-179

  Cotterell, B ^a   Chen, Z ^a  

^a INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

BUCKLING; COMPRESSIVE STRESS; CRACK INITIATION; DELAMINATION; INDIUM COMPOUNDS; POLYETHYLENE TEREPHTHALATES; SUBSTRATES; TENSILE STRESS;

ENERGY RELEASE RATE; INDIUM TIN OXIDE;

THIN FILMS;

EID: 0034230142     PISSN: 03769429     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1007628800620     Document Type: Article

References (14)