The fracture of brittle thin films on compliant substrates in flexible displays

Engineering Fracture Mechanics

Volumn 69, Issue 5, 2002, Pages 597-603

  Chen, Zhong ^a   Cotterell, Brian ^b   Wang, Wei ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING   (Singapore)

Author keywords

Delamination; Flexible displays; Fracture toughness; Indium tin oxide; Thin film

Indexed keywords

BRITTLE FRACTURE; BRITTLENESS; BUCKLING; COMPRESSION TESTING; CRACK PROPAGATION; DELAMINATION; SUBSTRATES; TENSILE TESTING;

ORGANIC LIGHT EMITTING DISPLAYS (OLED);

THIN FILMS;

BRITTLE FRACTURE; BUCKLING; COMPRESSION; DELAMINATION; FRACTURE TOUGHNESS; OXIDE FILM;

EID: 0037040743     PISSN: 00137944     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0013-7944(01)00104-7     Document Type: Article

References (10)

1. Electroluminescence in conjugated polymers
2. Flexible light-emitting-diodes made from soluble conducting polymers
3. Achieving full-color organic light-emitting devices for lightweight, flat-panel displays
4. Cracking of thin bonded films in residual tension
5. Mixed mode cracking in layered materials
6. Crack spacing in brittle films on elastic substrates
7. Combined buckling and cracking of films
8. Buckling and cracking of thin films on compliant substrate under compression