Study of a hydrogen-bombardment process for molecular cross-linking within thin films

Journal of Chemical Physics

Volumn 134, Issue 7, 2011, Pages

  Liu, Y ^a   Yang, D Q ^a   Nie, H Y ^a   Lau, W M ^a   Yang, J ^a  

^a UNIVERSITY OF WESTERN ONTARIO   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

AFM; AGGRESSIVE ENVIRONMENT; BOMBARDMENT PROCESS; C-H BOND; CARBON RADICALS; CHEMICAL ADDITIVE; EFFECT OF HYDROGEN; FILM SURFACES; FINE TUNING; HYDROGEN BOMBARDMENT; HYDROGEN MOLECULE; LOW ENERGIES; MOLECULAR CHAINS; MOLECULAR THIN FILM; ORGANIC SOLUTIONS; ORGANIC THIN FILMS; PHYSICAL AND CHEMICAL PROPERTIES; TRIBOLOGICAL PROPERTIES; XPS;

CHEMICAL ELEMENTS; CHEMICAL PROPERTIES; FILM GROWTH; HEXANE; HYDROGEN; MECHANICAL PROPERTIES; SILICON COMPOUNDS; SURFACE ROUGHNESS; THIN FILMS;

HYDROGEN BONDS;

2,3 BUTANEDIONE; ALKANE; HYDROGEN; SILICON DIOXIDE;

ARTICLE; ATOMIC FORCE MICROSCOPY; CHEMISTRY; MECHANICS; TIME; X RAY PHOTOELECTRON SPECTROSCOPY;

ALKANES; DIACETYL; HYDROGEN; MECHANICAL PROCESSES; MICROSCOPY, ATOMIC FORCE; PHOTOELECTRON SPECTROSCOPY; SILICON DIOXIDE; TIME FACTORS;

EID: 79951935644     PISSN: 00219606     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3554430     Document Type: Article

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