Development of a cmos-based capacitive tactile sensor with adjustable sensing range and sensitivity using polymer fill-in

Journal of Microelectromechanical Systems

Volumn 20, Issue 1, 2011, Pages 119-127

  Liu, Yu Chia ^a   Sun, Chih Ming ^a   Lin, Li Yuan ^a   Tsai, Ming Han ^a   Fang, Weileun ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

CMOS MEMS; polymer fill in; tactile sensor

Indexed keywords

CAPACITIVE-TYPE; CMOS PROCESSS; CMOS-MEMS; CURING AGENTS; DIELECTRIC CONSTANTS; EQUIVALENT STIFFNESS; FILLING PROCESS; POLYDIMETHYLSILOXANE PDMS; POST-CMOS; SENSING CIRCUITS; SENSING RANGES; TACTILE SENSOR; TACTILE SENSORS;

CMOS INTEGRATED CIRCUITS; MICROCHANNELS; POLYMERS; SENSORS; SILICONES; STIFFNESS;

FILLED POLYMERS;

EID: 79551598764     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2010.2090494     Document Type: Article

References (25)

1. J. Verd, A. Uranga, G. Abadal, J. Teva, F. Torres, J. L. Lopez, F. Perez-Murano, J. Esteve, and N. Barniol, "Monolithic CMOS MEMS oscillator circuit for sensing in the attogram range," IEEE Electron Device Lett., vol. 29, no. 2, pp. 146-148, Feb. 2008.
2. S. Eminoglu, D. S. Tezcan, M. Y. Tanrikulu, and T. Akin, "Low-cost uncooled infrared detectors in CMOS process," Sens. Actuator A, Phys., vol. 109, no. 1/2, pp. 102-113, Dec. 2003.
3. C. Hagleitner, D. Lange, A. Hierlemann, O. Brand, and H. Baltes, "CMOS single-chip gas detection system comprising capacitive calorimetric, and mass-sensitive sensors," IEEE J. Solid-State Circuits, vol. 37, no. 12, pp. 1867-1878, Dec. 2002.
4. T. Salo, K.-U. Kirstein, T. Vancura, and H. Baltes, "CMOS-based tactile microsensor for medical instrumentation," IEEE Sensors J., vol. 7, no. 2, pp. 258-265, Feb. 2007.
5. A. Wisitoraat, V. Patthanasetakul, T. Lomas, and A. Tuantranont, "Low cost thin film based piezoresistive MEMS tactile sensor," Sens. Actuator A, Phys., vol. 139, no. 1/2, pp. 17-22, Sep. 2007.
6. C. Li, P.-M. Wu, S. Lee, A. Gorton, M. J. Schulz, and C. H. Ahn, "Flexible dome and bump shape piezoelectric tactile sensors using PVDFTrFE copolymer," J. Microelectromech. Syst., vol. 17, no. 2, pp. 334-341, Apr. 2008.
7. K. J. Chun and K. D. Wise, "A high-performance silicon tactile imaging based on a capacitive cell," IEEE Trans. Electron Devices, vol. ED-32, no. 7, pp. 1196-1201, Jul. 1985.
8. Z. Chu, P. M. Sarro, and S. Middelhoek, "Silicon three-axial tactile sensor," Sens. Actuator A, Phys., vol. 54, no. 1-3, pp. 505-510, Jun. 1996.
9. C.-T. Ko, S.-H. Tseng, and M. S.-C. Lu, "A CMOS micromachined capacitive tactile sensor with high-frequency output," J. Microelectromech. Syst., vol. 15, no. 6, pp. 1708-1714, Dec. 2006.
10. N. Sato, S. Shigematsu, H. Morimura, M. Yano, K. Kudou, T. Kamei, and K. Machida, "Novel surface structure and its fabrication process for MEMS fingerprint sensor," IEEE Trans. Electron Devices, vol. 52, no. 5, pp. 1026-1032, May 2005.
11. H. Baltes, O. Brand, A. Hierlemann, D. Lange, and C. Hagleitner, "CMOS MEMS-Present and future," in Proc. IEEE Int. Conf. Micro Electro Mech. Syst., Las Vegas, NV, Jan. 2002, pp. 459-466.
12. J. Engel, J. Chen, and C. Liu, "Development of polyimide flexible tactile sensor skin," J. Micromech. Microeng., vol. 13, no. 3, pp. 359-366, Feb. 2003.
13. H. K. Lee, S. I. Chang, and E. Yoon, "A flexible polymer tactile sensor: Fabrication and modular expandability for large area deployment," J. Microelectromech. Syst., vol. 15, no. 6, pp. 1681-1685, Dec. 2006.
14. M.-Y. Cheng, X.-H. Huang, C.-W. Ma, and Y.-J. Yang, "A flexible capacitive tactile sensing array with floating electrodes," J. Micromech. Microeng., vol. 19, no. 11, p. 115 001, Sep. 2009.
15. E. Pritchard, M. Mahfouz, B. Evans, III, S. Eliza, andM. Haider, "Flexible capacitive sensors for high resolution pressure measurement," in Proc. IEEE Int. Conf. Sensors, Leece, Italy, Oct. 2008, pp. 1484-1487.
16. Y.-C. Liu, C.-M. Sun, L.-Y. Lin, M.-H. Tsai, and W. Fang, "A tunable range/sensitivity CMOS-MEMS capacitive tactile sensor with polymer fill-in technique," in Proc. IEEE Int. Conf. Transducers, Denver, CO, Jun. 2009, pp. 2190-2193.
17. C.-C. Wen and W. Fang, "Tuning the sensing range and sensitivity of three axes tactile sensors using the polymer composite membrane," Sens. Actuator A, Phys., vol. 145/146, pp. 14-22, Jul./Aug. 2008.
18. M. Adam, T. Mohacsy, P. Jonas, C. Ducso, E. Vazsonyi, and I. Barsony, "CMOS integrated tactile sensor array by porous Si bulk micromachining," Sens. Actuator A, Phys., vol. 142, no. 1, pp. 192-195, Mar. 2008.
19. J. C. Lotters, W. Olthuis, P. H. Veltink, and P. Bergveld, "Polydimethylsiloxane as an elastic material applied in a capacitive accelerometer," J. Micromech. Microeng., vol. 6, no. 1, pp. 52-54, Mar. 1996.
20. J. C. Lotters, W. Olthuis, P. H. Veltink, and P. Bergveld, "The mechanical properties of the rubber elastic polymer polydimethylsiloxane for sensor application," J. Micromech. Microeng., vol. 7, no. 3, pp. 145-147, Sep. 1997.
21. P. Peng, R. Rajamani, and A. G. Erdman, "Flexible tactile sensor for tissue elasticity measurement," J. Microelectromech. Syst., vol. 18, no. 6, pp. 1226-1233, Dec. 2009.
22. F. Roewer and U. Kleine, "A novel class of complementary foldedcascode opamps for low voltage," IEEE J. Solid-State Circuits, vol. 37, no. 8, pp. 1080-1083, Aug. 2002.
23. C. Wang, M.-H. Tsai, C.-M. Sun, and W. Fang, "A novel CMOS out-ofplane accelerometer with fully differential gap-closing capacitance sensing electrodes," J. Micromech. Microeng., vol. 17, no. 7, pp. 1275-1280, Jun. 2007.
24. M.-H. Tsai, C.-M. Sun, Y.-C. Liu, C. Wang, and W. Fang, "Design and fabrication of a metal wet-etching post-process for the improvement of CMOS-MEMS capacitive sensors," J. Micromech. Microeng., vol. 19, no. 10, p. 105 017, Sep. 2009.
25. N. Lazarus, S. S. Bedair, C.-C. Lo, and G. K. Fedder, "CMOS-MEMS capacitive humidity sensor," J. Microelectromech. Syst., vol. 19, no. 1, pp. 183-191, Feb. 2010.