Flexible capacitive sensors for high resolution pressure measurement

Proceedings of IEEE Sensors

Volumn , Issue , 2008, Pages 1484-1487

  Pritchard, Emily ^a   Mahfouz, Mohamed ^a   Evans III, Boyd ^a   Eliza, Sazia ^a   Haider, Mohammad ^a  

^a University of Tennessee Knoxville   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANALYTICAL MODEL; APPLIED LOADS; AXIAL STRAIN; CAPACITIVE PRESSURE SENSORS; CAPACITIVE SENSOR; FABRICATED SENSORS; FLEX CIRCUITS; FLEXIBLE CIRCUIT; FLEXIBLE SUBSTRATE; HIGH RESOLUTION; HIGH SPATIAL RESOLUTION; SMALL LOAD;

BIOMECHANICS; INTEGRATED CIRCUITS; PARTIAL PRESSURE SENSORS; PRESSURE MEASUREMENT; PRESSURE TRANSDUCERS; SENSOR ARRAYS;

PRESSURE SENSORS;

EID: 67649996006     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICSENS.2008.4716726     Document Type: Conference Paper

References (14)

1. C. Ashruf, "Thin flexible pressure sensors," Sensor Review, 2002, pp. 322-327. (Pubitemid 35359630)
2. Tekscan, South Boston, MA, USA. www.tekscan.com.
3. H. Hsiao, J. Guan, and M. Weatherly, "Accuracy and precision of two in-shoe pressure measurement systems." Ergonomics, vol.45, no. 8, 2002, pp. 537-555. (Pubitemid 34904865)
4. E. Hwang, Y. Kim, and B. Ju, "Flexible polysilicon sensor array modules using etch-release packaging scheme," Sensors and Actuators A:, Vol.111, No. 1, 2004, pp. 135-141.
5. Xsensor Technology Corporation, Calgary, AB, Canada. www.xsensor.com.
6. Novel, Munich, Germany, www.novel.de.
7. C. Hierold, et al. "Low power integrated pressure sensor system for medical applications," Sensors and Actuators A: Physical, vol.73, no. 1-2, 1999, pp. 58-67. (Pubitemid 30857800)
8. M. Akiyama, et al. "Flexible piezoelectric pressure sensors using oriented aluminum nitride thin films prepared on polyethylene terephthalate films," J of App. Phys, Vol.100, No. 11, 2006. (Pubitemid 43333267) (Pubitemid 43925056) (Pubitemid 44033215) (Pubitemid 44156795) (Pubitemid 44221356) (Pubitemid 44259933) (Pubitemid 46012245)
9. J. N. Palasagaram and R. Ramadoss, "Mems-capacitive pressure sensor fabricated using printed-circuit-processing techniques," Sensors Journal, IEEE, vol.6, no. 6, 2003, pp. 1374-1375, 2006.
10. J. Engel, J. Chen, and C. Liu, "Development of polyimide flexible tactile sensor skin," J.of Micromech.and Microengr., pp. 359-366.
11. F. Jiang, Y.-C. Tai, K. Walsh, T. Tsao, G.-B. Lee, and C.-M. Ho, "A flexible mems technology and its first application to shear stress sensor skin," in Micro Electro Mech Sys, MEMS'97, Proc., IEEE., 10th Annual Int'l, 1997, pp. 465-470.
12. K Williams, K. Gupta, and M. Wasilik. "Etch rates for micromachining processing-part II." J. Micro. Mech. Sys. Vol.12, No. 6, 2003, pp. 761-778.
13. S. Lian, K. Chen, R. Lee, J. Pan, and A. Hung. "Chemical etching of polyimide film." J. Appl. Poly. Sci. Vol.58 Iss. 9, pp. 1577-1584, 1995.
14. K. Lee, A. Singh, J. Heb, S. Massia, B. Kima, G. Raupp. "Polyimide based neural implants with stiffness improvement." Sensors and Actuators B Vol. 102, pp. 67-72, 2004.