Novel surface structure and its fabrication process for MEMS fingerprint sensor

IEEE Transactions on Electron Devices

Volumn 52, Issue 5, 2005, Pages 1026-1032

  Sato, Norio ^a   Shigematsu, Satoshi ^a   Morimura, Hiroki ^a   Yano, Masaki ^b   Kudou, Kazuhisa ^b   Kamei, Toshikazu ^b   Machida, Katsuyuki ^a  

^a NTT CORPORATION   (Japan)

^b NTT Advanced Technology Corporation   (Japan)

Author keywords

CMOS large scale integrated circuit (LSI); Elasticity; Fingerprint sensor; Microelectromechanical systems (MEMS); Sensitivity

Indexed keywords

CMOS INTEGRATED CIRCUITS; COPPER; ELASTICITY; INTEGRATED CIRCUIT MANUFACTURE; LSI CIRCUITS; MICROELECTROMECHANICAL DEVICES; PHOTOSENSITIVITY; POLYIMIDES; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICE STRUCTURES; SEMICONDUCTOR DEVICE TESTING; SURFACE STRUCTURE;

FINGER SURFACE CONDITIONS; FINGERPRINT SENSOR; PHOTOSENSITIVE POLYIMIDE; PROTRUSIONS; SENSOR SURFACE;

MICROSENSORS;

EID: 18844425993     PISSN: 00189383     EISSN: None     Source Type: Journal    
DOI: 10.1109/TED.2005.846342     Document Type: Article

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