Mechanical alloying synthesis and soldering microstructures of nanocrystalline Sn-3.5Ag-0.7Cu alloy powders

Journal of Alloys and Compounds

Volumn 497, Issue 1-2, 2010, Pages 396-401

  Tang, Wenming ^a   Zhang, Hong ^a   Wu, Yucheng ^a   Zheng, Zhixiang ^a  

^a HEFEI UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Mechanical alloying; Microstructure; Sn 3.5Ag 0.7Cu alloy; Soldering

Indexed keywords

AVERAGE PARTICLE SIZE; CU ALLOY; CU SUBSTRATE; HYPEREUTECTIC STRUCTURE; INTERMETALLIC COMPOUNDS; LAYER INTERFACES; MILLED POWDERS; NANOCRYSTALLINES; SN-3.5AG; SUPERSATURATED SOLID SOLUTIONS;

CERIUM ALLOYS; COPPER ALLOYS; COPPER POWDER METALLURGY; MECHANICAL ALLOYING; METALLURGY; MICROSTRUCTURE; NANOCRYSTALLINE ALLOYS; NANOCRYSTALLINE POWDERS; SEMICONDUCTING INTERMETALLICS; SILVER; SILVER ALLOYS; SOLDERING; SOLDERING ALLOYS; TIN ALLOYS;

TIN;

EID: 77950945145     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2010.03.087     Document Type: Article

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