Copper coverage effect on tungsten crystallites texture development in W/Cu nanocomposite thin films

Journal of Applied Physics

Volumn 109, Issue 1, 2011, Pages

  Girault, B ^a,b   Eyidi, D ^b   Chauveau, T ^c   Babonneau, D ^b   Renault, P O ^b   Le Bourhis, E ^b   Goudeau, P ^b  

^a INM LEIBNIZ INSTITUTE FOR NEW MATERIALS   (Germany)

^b UNIVERSITÉ DE POITIERS   (France)

^c UNIVERSITÉ PARIS 13   (France)

Author keywords

[No Author keywords available]

Indexed keywords

COLUMNAR GROWTH; COMPRESSIVE RESIDUAL STRESS; COPPER NANOPARTICLES; CRYSTALLOGRAPHIC ORIENTATIONS; CRYSTALLOGRAPHIC STRUCTURE; FILM-SUBSTRATE INTERFACES; GRAZING INCIDENCE SMALL-ANGLE X-RAY SCATTERING; GROWTH DIRECTIONS; IN-PLANE; LATTICE PARAMETER VALUES; MATRIX; MULTI-LAYERED; NANOCOMPOSITE THIN FILMS; POLYCRYSTALLINE; PREFERENTIAL ORIENTATION; STEREOLOGY; SURFACE ENERGY ANISOTROPY; TEM; TEXTURE COMPONENTS; TEXTURE DEVELOPMENT; TUNGSTEN LAYERS; XRD;

ADSORPTION; COPPER; DEPOSITION; FILM GROWTH; NANOCOMPOSITES; PHYSICAL VAPOR DEPOSITION; RESIDUAL STRESSES; SINGLE CRYSTALS; SURFACE CHEMISTRY; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY; TUNGSTEN; X RAY DIFFRACTION; X RAY SCATTERING;

TEXTURES;

EID: 78751533430     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3524264     Document Type: Article

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