Functionally graded materials by electrochemical processing and infiltration: Application to tungsten/copper composites

Journal of Materials Science

Volumn 35, Issue 2, 2000, Pages 477-486

  Jedamzik, R ^a   Neubrand, A ^a   Rodel J ^a  

^a DARMSTADT UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTROCHEMICAL ELECTRODES; ELECTROCHEMISTRY; INFILTRATION; POROUS MATERIALS; TUNGSTEN;

FUNCTIONALLY GRADED MATERIALS;

COMPOSITE MATERIALS;

EID: 0033906520     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1004735904984     Document Type: Article

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