Physical origin of spontaneous interfacial alloying in immiscible W/Cu multilayers

Journal of Materials Science

Volumn 42, Issue 17, 2007, Pages 7446-7450

  Villain, Pascale ^a   Goudeau, Philippe ^a   Badawi, Frederic ^a   Ouyang, G ^b   Yang, G W ^b   Pélosin, Véronique ^c  

^a UNIVERSITÉ DE POITIERS   (France)

^b SUN YAT SEN UNIVERSITY   (China)

^c ENSMA   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ALLOYING; COPPER; DIFFUSION; SPUTTER DEPOSITION;

DIFFUSION COEFFICIENTS; IMPLANTATION EFFECTS; METASTABLE SOLID SOLUTION;

TUNGSTEN;

EID: 34547301381     PISSN: 00222461     EISSN: 15734803     Source Type: Journal    
DOI: 10.1007/s10853-007-1605-y     Document Type: Article

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