Processing and microstructure of functionally graded W/Cu composites fabricated by multi-billet extrusion using mechanically alloyed powders

Composites Science and Technology

Volumn 66, Issue 13, 2006, Pages 2329-2336

  Li, Shi Bo ^a   Xie, Jian Xin ^b  

^a BEIJING JIAOTONG UNIVERSITY   (China)

^b UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING   (China)

Author keywords

A. Metal matrix composite (MMC); D. Scanning electron microscopy (SEM); D. X ray diffraction (XRD); E. Extrusion; Functionally graded W Cu composite

Indexed keywords

BINDERS; COPPER; MECHANICAL ALLOYING; METAL EXTRUSION; METALLIC MATRIX COMPOSITES; METALLOGRAPHIC MICROSTRUCTURE; POWDER METALS; SCANNING ELECTRON MICROSCOPY; SINTERING; TUNGSTEN; X RAY DIFFRACTION ANALYSIS;

FUNCTIONALLY GRADED COMPOSITE; MECHANICALLY ALLOYED POWDERS; MULTI-BILLET EXTRUSION;

FUNCTIONALLY GRADED MATERIALS;

ALLOY; COMPOSITE; EXTRUSION; MICROSTRUCTURE; POWDER; SCANNING ELECTRON MICROSCOPY; SINTERING; X-RAY ANALYSIS;

EID: 33746074470     PISSN: 02663538     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compscitech.2005.11.034     Document Type: Article

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